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re: TSMC ready to flip the switch on EUV
krisi   9/8/2011 6:29:07 PM
Testing all 3 competing lithography techniques sounds like an expensive proposition. It probably also means that it is still unclear which one will move to manufacturing...Kris

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re: TSMC ready to flip the switch on EUV
GoViking   9/7/2011 6:49:52 PM
E-beam direct write...Long time coming!: I visited Bill Livesay at E-Beam Microfabrication (EBM) on Miramar Rd in San Diego in 1978, who was a pioneer in e-beam direct write; Howard Bogert published a newsletter in about 1980 for Dataquest, entitled, "E-Beam is Economic for Mask-Making". Maybe only the hard stop now faced by optical litho pushes e-beam to the forefront...or maybe not. We always have a way of extending the lifetime of 'inertial' technologies more than we ever imagined was possible.

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re: TSMC ready to flip the switch on EUV
resistion   9/6/2011 12:40:50 PM
To be fair, other companies have tried other NGLs besides EUV as well. Toshiba and Samsung have worked on imprint, IBM and Samsung worked on DSA. Long ago Intel, IBM tried xray.

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re: TSMC ready to flip the switch on EUV
resistion   9/6/2011 12:04:46 PM
Didn't hear much detail about the kla tool.

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Replay available now: A handful of emerging network technologies are competing to be the preferred wide-area connection for the Internet of Things. All claim lower costs and power use than cellular but none have wide deployment yet. Listen in as proponents of leading contenders make their case to be the metro or national IoT network of the future. Rick Merritt, EE Times Silicon Valley Bureau Chief, moderators this discussion. Join in and ask his guests questions.

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