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re: TSMC ready to flip the switch on EUV
krisi   9/8/2011 6:29:07 PM
Testing all 3 competing lithography techniques sounds like an expensive proposition. It probably also means that it is still unclear which one will move to manufacturing...Kris

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re: TSMC ready to flip the switch on EUV
GoViking   9/7/2011 6:49:52 PM
E-beam direct write...Long time coming!: I visited Bill Livesay at E-Beam Microfabrication (EBM) on Miramar Rd in San Diego in 1978, who was a pioneer in e-beam direct write; Howard Bogert published a newsletter in about 1980 for Dataquest, entitled, "E-Beam is Economic for Mask-Making". Maybe only the hard stop now faced by optical litho pushes e-beam to the forefront...or maybe not. We always have a way of extending the lifetime of 'inertial' technologies more than we ever imagined was possible.

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re: TSMC ready to flip the switch on EUV
resistion   9/6/2011 12:40:50 PM
To be fair, other companies have tried other NGLs besides EUV as well. Toshiba and Samsung have worked on imprint, IBM and Samsung worked on DSA. Long ago Intel, IBM tried xray.

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re: TSMC ready to flip the switch on EUV
resistion   9/6/2011 12:04:46 PM
Didn't hear much detail about the kla tool.

In conjunction with unveiling of EE Times’ Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. One of Silicon Valley's great contributions to the world has been the demonstration of how the application of entrepreneurship and venture capital to electronics and semiconductor hardware can create wealth with developments in semiconductors, displays, design automation, MEMS and across the breadth of hardware developments. But in recent years concerns have been raised that traditional venture capital has turned its back on hardware-related startups in favor of software and Internet applications and services. Panelists from incubators join Peter Clarke in debate.
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