You guys might want to take a look at this EETimes article from three years ago, before taking this announcement.
Indeed, another example of how duct tape remains the ultimate engineering tool. Comments about the need for more information to understand this are certainly understandable. The nitty gritty details remain sketchy at this point. Presumably we will find out at least a little bit more once IBM and 3M make the announcement (which the WSJ report indicates will happen this week).
Certainly, from server blade experience, we need to flow air or other fluid in between chip planes because stagnant medium will warm up which is inadequate for heat sinking. So I had thought they were heading in some microfluidic direction.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.