Breaking News
Comments
Newest First | Oldest First | Threaded View
resistion
User Rank
CEO
re: Report: IBM, 3M to team on chip stacking
resistion   9/7/2011 7:55:45 AM
NO RATINGS
You guys might want to take a look at this EETimes article from three years ago, before taking this announcement. http://www.eetimes.com/electronics-news/4077160/IBM-GIT-demo-3D-die-with-microchannel-cooling

mcgrathdylan
User Rank
Blogger
re: Report: IBM, 3M to team on chip stacking
mcgrathdylan   9/7/2011 6:49:03 AM
NO RATINGS
Indeed, another example of how duct tape remains the ultimate engineering tool. Comments about the need for more information to understand this are certainly understandable. The nitty gritty details remain sketchy at this point. Presumably we will find out at least a little bit more once IBM and 3M make the announcement (which the WSJ report indicates will happen this week).

seaEE
User Rank
CEO
re: Report: IBM, 3M to team on chip stacking
seaEE   9/7/2011 4:08:54 AM
NO RATINGS
Double-sided sticky tape to the rescue once again! ;)

sureshtheory
User Rank
Rookie
re: Report: IBM, 3M to team on chip stacking
sureshtheory   9/7/2011 3:53:51 AM
NO RATINGS
Sure... need more info to understand this... if implemented what are advantages over 3D transistor implementation??

resistion
User Rank
CEO
re: Report: IBM, 3M to team on chip stacking
resistion   9/7/2011 3:36:42 AM
NO RATINGS
Certainly, from server blade experience, we need to flow air or other fluid in between chip planes because stagnant medium will warm up which is inadequate for heat sinking. So I had thought they were heading in some microfluidic direction.

_hm
User Rank
CEO
re: Report: IBM, 3M to team on chip stacking
_hm   9/7/2011 2:18:11 AM
NO RATINGS
Need more technical information to understand the concept.

greenpattern
User Rank
Rookie
re: Report: IBM, 3M to team on chip stacking
greenpattern   9/7/2011 1:13:27 AM
NO RATINGS
Many electrical engineers seem to have not passed thermodynamics. Heat conduction requires a temperature gradient. No such helpful gradient between stacked chips (especially in the middle).



Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

The Best of the Best Videos on YouTube
Max Maxfield
2 comments
A couple of days ago, my chum Paul was visiting me in my office. He'd wandered over from his cubicle in the next bay to take a brief coffee break. This week, Paul had been admiring the ...

Jolt Judges and Andrew Binstock

Jolt Awards: The Best Books
Jolt Judges and Andrew Binstock
1 Comment
As we do every year, Dr. Dobb's recognizes the best books of the last 12 months via the Jolt Awards -- our cycle of product awards given out every two months in each of six categories. No ...

Engineering Investigations

Air Conditioner Falls From Window, Still Works
Engineering Investigations
2 comments
It's autumn in New England. The leaves are turning to red, orange, and gold, my roses are in their second bloom, and it's time to remove the air conditioner from the window. On September ...

David Blaza

The Other Tesla
David Blaza
5 comments
I find myself going to Kickstarter and Indiegogo on a regular basis these days because they have become real innovation marketplaces. As far as I'm concerned, this is where a lot of cool ...