Embedded Systems Conference
Breaking News
Newest First | Oldest First | Threaded View
User Rank
re: IBM, 3M to collaborate on 3-D chip stacking
IFTLE   9/10/2011 4:49:35 PM
Most folks call this thermal underfill. Getting one optimized for 3D stacking is certainly a worthy goal.

User Rank
re: IBM, 3M to collaborate on 3-D chip stacking
docdivakar   9/8/2011 5:44:35 PM
@RobDinsmore: I assume you are commenting on Intel's trigate technology (monolithic 3D) but Intel has also done pioneering work on 3D stacked chips starting 2002! It is true the marketing folks get carried away with what is realistic with all these new technologies but I wouldn't lower that to the BS-level! @daleste: I agree, it is a challenge to develop materials for joining substrates, providing thermal pathways matching the conductivities of Silicon but therein lies the problem. There aren't too many gap filling materials with particle sizes in the order of a few microns. There are some promises in some emerging nano-particle based adhesives that the printed electronics industry seems to be forging ahead with (3M has a good presence there). Dr. MP Divakar

User Rank
re: IBM, 3M to collaborate on 3-D chip stacking
RobDinsmore   9/8/2011 4:32:49 PM
I am glad that IBM 'makes fun' of Intel's ridiculous 3-D marketing BS. I am also glad that IBM is still investing heavily in research.

User Rank
re: IBM, 3M to collaborate on 3-D chip stacking
daleste   9/8/2011 12:57:45 AM
An extension of existing technology, but I bet they get many patents to keep others out. The thermal problem will be interesting.

Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

ESC Silicon Valley 2015 Sneak Peek! Using Arduinos & ChipKITs for Rapid Prototyping
Max Maxfield
Post a comment
When it comes to my hobby projects, I'm a huge fan of Arduino and ChipKIT microcontroller development boards. One of the big attractions is the huge ecosystem that's grown around these ...

Bernard Cole

A Book For All Reasons
Bernard Cole
1 Comment
Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
EE Times Senior Technical Editor Martin Rowe will interview EMC engineer Kenneth Wyatt.
Flash Poll