Embedded Systems Conference
Breaking News
Comments
daleste
User Rank
Author
re: IBM, 3M to collaborate on 3-D chip stacking
daleste   9/8/2011 12:57:45 AM
NO RATINGS
An extension of existing technology, but I bet they get many patents to keep others out. The thermal problem will be interesting.

RobDinsmore
User Rank
Author
re: IBM, 3M to collaborate on 3-D chip stacking
RobDinsmore   9/8/2011 4:32:49 PM
NO RATINGS
I am glad that IBM 'makes fun' of Intel's ridiculous 3-D marketing BS. I am also glad that IBM is still investing heavily in research.

docdivakar
User Rank
Author
re: IBM, 3M to collaborate on 3-D chip stacking
docdivakar   9/8/2011 5:44:35 PM
NO RATINGS
@RobDinsmore: I assume you are commenting on Intel's trigate technology (monolithic 3D) but Intel has also done pioneering work on 3D stacked chips starting 2002! It is true the marketing folks get carried away with what is realistic with all these new technologies but I wouldn't lower that to the BS-level! @daleste: I agree, it is a challenge to develop materials for joining substrates, providing thermal pathways matching the conductivities of Silicon but therein lies the problem. There aren't too many gap filling materials with particle sizes in the order of a few microns. There are some promises in some emerging nano-particle based adhesives that the printed electronics industry seems to be forging ahead with (3M has a good presence there). Dr. MP Divakar

IFTLE
User Rank
Author
re: IBM, 3M to collaborate on 3-D chip stacking
IFTLE   9/10/2011 4:49:35 PM
NO RATINGS
Most folks call this thermal underfill. Getting one optimized for 3D stacking is certainly a worthy goal.



Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

An Appetizing Archive of Propitious & Pragmatic Resources
Max Maxfield
Post a comment
Quite a few Pooh Sticks have drifted under the bridge since I first came into contact with my chum and fellow EE Times blogger Adam Taylor. It all started when I read one of Adam's columns ...

Jack Ganssle, Embedded.com

Processor Pinups
Jack Ganssle, Embedded.com
4 comments
My wife and I joke about our “adult” magazines. For her, those are the publications about beading. For me, they’re tool catalogs and Fine Woodworking magazine. The latter ...

Rajaram Regupathy, Cypress Semiconductor

Add USB Battery Charging Protocols to an Android-Based Design
Rajaram Regupathy, Cypress Semiconductor
Post a comment
Editorial Note: Excerpted from Unboxing Android: A hands on approach with real world examples, by Rajaram Regupathy, the author takes you through the process incorporating effective power ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
Doug Bailey, VP of marketing at Power Integrations, gives a ...
See how to ease software bring-up with DesignWare IP ...
DesignWare IP Prototyping Kits enable fast software ...
This video explores the LT3086, a new member of our LDO+ ...
In today’s modern electronic systems, the need for power ...
Radio
LATEST ARCHIVED BROADCAST
EE Times Senior Technical Editor Martin Rowe will interview EMC engineer Kenneth Wyatt.
Flash Poll