i agree, but this article sounds more like any research paper. The only comment about the move to manufacturing is,"IBM's paper is set to move that on towards a maufacturable technology based on CMOS-compatible fabrication on 200-mm diameter wafers."
re: "...define gate structures first on silicon wafers..." All that SiO2 (insulator) in the illustrations -- wonder if they're doing this work starting on SOI wafers -- does anyone know? (I know they do currently have a very successful RF/CMOS foundry offering that does start on SOI wafers -- see http://www.advancedsubstratenews.com/2007/10/rf-all-in-one/ ....)
Complaint with IBM China CSR on Centennial
[ Review ] How Much IBM Can Get Away with is the Responsibility of the Media
Tragedy of Labor Rights Repression in IBM China
Scandal stricken IBM detained mother of ex-employee on the day of centennial
It is exciting to see graphene moving from theory to reality. Since carbon is available in unlimited quantities, will graphene circuits have environmental benefits also in terms of reduced usage of rare and toxic materials in electronics fabrication?
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.