Embedded Systems Conference
Breaking News
Comments
Newest First | Oldest First | Threaded View
docdivakar
User Rank
Author
re: Price cited as top challenge in 3-D stacks
docdivakar   10/28/2011 6:32:05 PM
NO RATINGS
@KB3001: TSV technology of today has ways to go and is still cost-prohibitive as the article says. The keepouts penalties on the real estate is a bit too much for low-cost memory applications. If we approach below 5u dia TSV's in large volume production, there is a play in the market. TSV technology is also needed even in 2.5D incarnations for chip to chip communications that can not be otherwise realized on board with separate components. MP Divakar

dirk.bruere
User Rank
Author
re: Price cited as top challenge in 3-D stacks
dirk.bruere   10/6/2011 9:24:37 PM
NO RATINGS
30 years ago I remember naively thinking that as more transistors were crammed onto chips, the fewer pins would be needed on the package.

goafrit
User Rank
Author
re: Price cited as top challenge in 3-D stacks
goafrit   10/6/2011 5:22:07 PM
NO RATINGS
That happens for every new innovation. No surprises there.

chipmonk0
User Rank
Author
re: Price cited as top challenge in 3-D stacks
chipmonk0   10/6/2011 10:04:52 AM
NO RATINGS
Nothing very original here in that "price will be a roadblock for wide spread adoption of 3D TSV stacks " ! New packaging technologies like TSVs have always had to wait for a killer application to come along and volume to grow before consumer electronics vendors like Qualcomm can afford to use them. Meanwhile niche players like Tezzaron have been making memory modules w/ TSV for a few years already. Reducing the latency for off CPU DRAM ( for Servers etc. ) by TSV provide them with a big enough niche. But the high bandwidth ( wide I/O ) and lower power potential for TSV memory stacks remains very tempting for the handheld segment. It would perhaps take the next Jobs to rise and define the killer application ( movies ? ) for TSVs before current TSV leaders like Elpida or Samsung can really risk HVM. Words of caution. Not only would the TSV vias themselves take up die real estate but they would also require additional keep-out zones for via-induced stress fields. So the adoption of something obvious & grossly mechanical like TSVs might get delayed if elegant electrical alternatives can be worked out at the die & package level.

resistion
User Rank
Author
re: Price cited as top challenge in 3-D stacks
resistion   10/6/2011 5:17:41 AM
NO RATINGS
I think probably a fairer (and definitely more preferred by TSV folks!) way of assessing cost is to consider TSVs only in the I/O/board domain. Then they will appear as the Moore's law analog of shrinking with better performance, at the interchip level rather than intrachip level.

resistion
User Rank
Author
re: Price cited as top challenge in 3-D stacks
resistion   10/6/2011 4:18:48 AM
NO RATINGS
"More broadly, TSVs could help the semiconductor industry keep on its historic rate of offering a 30 percent cost reductions in transistors every year. Rising costs of lithography due in part to delays in extreme ultraviolet technology may challenge the industry to maintain that pace without TSVs, Nowak said." I think the two points confused are that EUV itself will impose higher costs and TSVs take up area that can be used for transistors.

KB3001
User Rank
Author
re: Price cited as top challenge in 3-D stacks
KB3001   10/6/2011 12:08:40 AM
NO RATINGS
Yields will improve with time as fabs develop more robust procedures. This will happen because the case for TSV technology is simply too strong as we reach the limit of tansistor feature sizes.



Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

ESC Boston 2015 Sneak Peek -- Awesome Analog Meters
Max Maxfield
Post a comment
Almost any information that is captured by a sensor or generated by an electronic or electro-mechanical system can be displayed in analog or digital fashion. A common example with which we ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
2 comments
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rajaram Regupathy, Cypress Semiconductor

Add USB Battery Charging Protocols to an Android-Based Design
Rajaram Regupathy, Cypress Semiconductor
Post a comment
Editorial Note: Excerpted from Unboxing Android: A hands on approach with real world examples, by Rajaram Regupathy, the author takes you through the process incorporating effective power ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
Doug Bailey, VP of marketing at Power Integrations, gives a ...
See how to ease software bring-up with DesignWare IP ...
DesignWare IP Prototyping Kits enable fast software ...
This video explores the LT3086, a new member of our LDO+ ...
In today’s modern electronic systems, the need for power ...
Radio
LATEST ARCHIVED BROADCAST
EE Times Senior Technical Editor Martin Rowe will interview EMC engineer Kenneth Wyatt.
Flash Poll