This looks like a Samsung Micron challenge to the IBM-3M "Silicon Brick" (TM) project.
This Chip-to-Brick or Chip-to-Cube approach now looks like the way forward. Among other things, for IBM and Samsung, it might be a way of solving any near term phase change memory (PCM) scaling problems and provide a cost effective way in which different memory and processor resources can be mixed, as, for all chip types, scaling fab costs rise and the cost of hybrid assembly becomes a reasonable alternative.
As we unveil EE Times’ 2015 Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. Panelists Dan Armbrust (investment firm Silicon Catalyst), Andrew Kau (venture capital firm Walden International), and Stan Boland (successful serial entrepreneur, former CEO of Neul, Icera) join in the live debate.