This looks like a Samsung Micron challenge to the IBM-3M "Silicon Brick" (TM) project.
This Chip-to-Brick or Chip-to-Cube approach now looks like the way forward. Among other things, for IBM and Samsung, it might be a way of solving any near term phase change memory (PCM) scaling problems and provide a cost effective way in which different memory and processor resources can be mixed, as, for all chip types, scaling fab costs rise and the cost of hybrid assembly becomes a reasonable alternative.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.