This looks like a Samsung Micron challenge to the IBM-3M "Silicon Brick" (TM) project.
This Chip-to-Brick or Chip-to-Cube approach now looks like the way forward. Among other things, for IBM and Samsung, it might be a way of solving any near term phase change memory (PCM) scaling problems and provide a cost effective way in which different memory and processor resources can be mixed, as, for all chip types, scaling fab costs rise and the cost of hybrid assembly becomes a reasonable alternative.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.