This looks like a Samsung Micron challenge to the IBM-3M "Silicon Brick" (TM) project.
This Chip-to-Brick or Chip-to-Cube approach now looks like the way forward. Among other things, for IBM and Samsung, it might be a way of solving any near term phase change memory (PCM) scaling problems and provide a cost effective way in which different memory and processor resources can be mixed, as, for all chip types, scaling fab costs rise and the cost of hybrid assembly becomes a reasonable alternative.
Replay available now: A handful of emerging network technologies are competing to be the preferred wide-area connection for the Internet of Things. All claim lower costs and power use than cellular but none have wide deployment yet. Listen in as proponents of leading contenders make their case to be the metro or national IoT network of the future. Rick Merritt, EE Times Silicon Valley Bureau Chief, moderators this discussion. Join in and ask his guests questions.