Seems like a good start at 10um TSV. The article leaves out subsequent metallization / via fill capability of ASSID. I also would like to know the planarization of the metal fill in the TSV.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.