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ATUL SRIVASTAVA
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re: Perfecting the 3-D chip
ATUL SRIVASTAVA   10/13/2011 6:32:55 AM
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This will obviously need new generation of EDA tools too . What is the status on that front ?

Rchandta1
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re: Perfecting the 3-D chip
Rchandta1   10/13/2011 12:04:26 AM
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.."volume commercialization of heterogeneous stacks of processor, memory, mixed-signal, networking and I/O chips formed into silicon skyscrapers as high as 100 chips per stack .." - this is very ambitious goal!! Generally sounds reasonable, but very skeptical of the idea of liquid cooling. May fine for special application but definitely not for commercial.

resistion
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re: Perfecting the 3-D chip
resistion   10/12/2011 6:32:45 PM
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One also mustn't lose sight of 3d interconnect taking up more and more area especially with more and more stacked dies.

resistion
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re: Perfecting the 3-D chip
resistion   10/12/2011 6:30:25 PM
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Hope that can remain an option not become a specific requirement. :)

elctrnx_lyf
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re: Perfecting the 3-D chip
elctrnx_lyf   10/12/2011 6:19:52 PM
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will this technology be complete future in the next few years to much higher density processors on a single chip.

JoeData
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re: Perfecting the 3-D chip
JoeData   10/12/2011 5:49:15 PM
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Sounds like a perfect use for industrial diamonds - underfill material!

chipmonk0
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re: Perfecting the 3-D chip
chipmonk0   10/12/2011 5:11:26 PM
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An excellent overview of current 3D status and roadmap except for the glaring omission of Allvia - a small foundry located right here in Si Valley that has pioneered TSV technology at a prototype level for the last 5-6 years and provides smaller customers access to this technology. They also have Si Interposers with integrated capacitors.

Astronut0
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re: Perfecting the 3-D chip
Astronut0   10/12/2011 4:19:51 PM
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hm: You're right! Although 3D itself shouldn't affect lifetime (none of our 3D-ICs from 2004 have failed yet), when more circuitry is added the mean time between failures is likely to become unacceptably small. Continual on-chip testing may be the answer.

_hm
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re: Perfecting the 3-D chip
_hm   10/11/2011 11:04:10 PM
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Long term reliability of these parts is also of concern. There has to be new testing methodology.

resistion
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CEO
re: Perfecting the 3-D chip
resistion   10/11/2011 10:48:52 PM
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The serial nature of stacking and the vertical thermal proximity are fundamental concerns.

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