Hi Sharps_eng, part of our trade offs are based on trying to fit a desired market space based on cost of the GreenPAK family. In order to do that we needed to set the part up certain ways, hence we used One-Time NVM rather than a multiple programming device. Some of the other things we would have liked to include would be additional logic, I2C, maybe Op Amps, etc. But it's hard to make a product that works for everyone and still keep the die small enough to be able to meet certain price targets.
if you have additional questions, please email them to me... I'd be glad to continue this conversation. you can reach me at acooperman (at) silego.com
There is always a tradeoff when selecting a Swiss-Army-Knife set of tools to make a combination product. What was the thinking behind the parts on offer here? Can you share some of your thinking, what is missing that you wanted to include? Maybe we can start a useful discussion, useful chip functions that no-one has provided in combo before.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.