Embedded Systems Conference
Breaking News
Comments
Newest First | Oldest First | Threaded View
pinhead1
User Rank
Author
re: Infineon to make power ICs on 300-mm wafers
pinhead1   10/13/2011 5:16:07 PM
NO RATINGS
I am not aware of any SiC or GaN 300mm wafer supply... In fact, I don't even think you can get 200mm substrates with those materials. I think you can grow SiC epi on a silicon substrate, but I doubt that is an efficient way to make power devices. I'm no expert in power, though.

Peter Clarke
User Rank
Author
re: Infineon to make power ICs on 300-mm wafers
Peter Clarke   10/13/2011 8:34:10 AM
NO RATINGS
Yes this refers to silicon wafers. Although I am sure Infineon is working on silicon-carbide and gallium-nitride as well.

resistion
User Rank
Author
re: Infineon to make power ICs on 300-mm wafers
resistion   10/13/2011 3:36:39 AM
NO RATINGS
Without it being mentioned, I guess these devices are still silicon, not SiC or GaN? Wafer thinning and warping is harder for lithography no doubt!

goafrit
User Rank
Author
re: Infineon to make power ICs on 300-mm wafers
goafrit   10/12/2011 9:35:23 PM
NO RATINGS
I do not see this rush to lower feature size. Does it truly matter?

chanj0
User Rank
Author
re: Infineon to make power ICs on 300-mm wafers
chanj0   10/12/2011 7:25:29 PM
NO RATINGS
If resistance is indeed lower and heat is dissipated more efficiently with same current capacity, it means the efficiency is higher. It sounds a great improvement to me. Any further information and insight?

elctrnx_lyf
User Rank
Author
re: Infineon to make power ICs on 300-mm wafers
elctrnx_lyf   10/12/2011 5:12:00 PM
NO RATINGS
does the thin wafers will have same current capacity?



Radio
NEXT UPCOMING BROADCAST
Why Connect a Car?
May 11, 1pm EDT Monday
Overview: Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.
Top Comments of the Week
Flash Poll
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Special Video Section
LED lighting is an important feature in today’s and future ...
Active balancing of series connected battery stacks exists ...
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...