Breaking News
Comments
Newest First | Oldest First | Threaded View
Etmax
User Rank
Author
re: According to George: The rules dont apply to us
Etmax   11/23/2011 2:48:40 PM
NO RATINGS
But isn't the verification part of the design process of the chip, rather than its manufacture? In automotive design the design is designed and verified not unlike a chip design is designed and verified. Aren't we designing parts and process so that volume production is a multiple of the same? The design process happens only once, so that process has to contain significant verification. Maybe I'm missing something here??

Duane Benson
User Rank
Author
re: According to George: The rules dont apply to us
Duane Benson   10/31/2011 4:50:35 AM
NO RATINGS
Is it possible that the complexity of a big chip is simply beyond the tools of the time? An airplane can have its wing spar tested. It can have FEA performed on fasteners. It can have the shape tested in a wind tunnel or in a simulator. According to the Boeing web site, there are six million parts in a 747 with half being fasteners. The 747 has a pretty good record of having quality designed in as well as a good record of test and inspection. Does it matter that all of the parts are big enough to hold in your hand? Modern CPUs have transistor counts of 3/4 of a billion and up. FPGAs and memory chips get up in to the multiple billions. I can see some functional blocks as being relatively easy to both design quality in and verify after the fact (memory), but other sections, the complexity is just mind-boggling. Design schedules are likely a big factor as well. Designers are far too often simply not given enough days on the calendar to spend the time necessary to design enough quality in at the start.

cdhmanning
User Rank
Author
re: According to George: The rules dont apply to us
cdhmanning   10/30/2011 6:40:19 PM
NO RATINGS
From 50,000 ft all design domains (ie. automotive, chip, software, bridges) share some characteristics. What differs though is the cost or verification and testing vs the cost of error. It is, however, important to draw the distinction between design testing/verification and per-unit verification testing. Verification of the design of a chip or a new car model is very different to testing each individual chip or car on the line. We can do "unit testing" on everything from cables and bolts to parts of a chip design to software.We can also do integration testing on sub-assemblies of the above. However the cost/value trade off of doing these tests is differenc across different domains. Where the difference shows up is in the cost of a "do over". In software and chip design, the cost of constructing a sub-assembly to test partial assembly is relatively cheap (assuming you can use an FPGA for the chip testing). When building a bridge that is not the case. So while it is interesting to have a look at different ideas and look for opportunities for cross pollenation, it is not a given that they will be beneficial.



Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Radio
LATEST ARCHIVED BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

Brought to you by:

Like Us on Facebook
Special Video Section
The LTC2380-24 is a versatile 24-bit SAR ADC that combines ...
In this short video we show an LED light demo to ...
02:46
Wireless Power enables applications where it is difficult ...
07:41
LEDs are being used in current luxury model automotive ...
With design sizes expected to increase by 5X through 2020, ...
01:48
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...