Breaking News
Comments
Newest First | Oldest First | Threaded View
Duane Benson
User Rank
Author
re: IBM researchers to report carbon feats at IEDM
Duane Benson   10/31/2011 5:08:39 AM
NO RATINGS
The Silicon atom is about .24 nm. Carbon is about .14 - a bit more than half as big. It looks like there's still some room to make transistors smaller than the sub-10 nm. Not much though. I don't see any solids with a diameter smaller than carbon so that may be it for the traditional binary logic building block. It's getting close to time to look for something that will give a couple more states from the same size device.

nicolas.mokhoff
User Rank
Author
re: IBM researchers to report carbon feats at IEDM
nicolas.mokhoff   10/31/2011 4:03:19 AM
NO RATINGS
pixies: thanks for picking up on misspelled word. Has been corrected.

wilber_xbox
User Rank
Author
re: IBM researchers to report carbon feats at IEDM
wilber_xbox   10/29/2011 4:48:46 PM
NO RATINGS
Feynman said that there is plenty of room at the bottom. We are hitting the bottom and it is full of surprises. Graphene, CNT, Nanowires, variation of FinFET will compete for the lower technology nodes for sure.

wilber_xbox
User Rank
Author
re: IBM researchers to report carbon feats at IEDM
wilber_xbox   10/29/2011 4:46:35 PM
NO RATINGS
ha ha. Readers have found out so many misspell in EETimes blogs in recent times. Hope it will improve.

pixies
User Rank
Author
re: IBM researchers to report carbon feats at IEDM
pixies   10/28/2011 8:05:14 PM
NO RATINGS
Is "grapheme" a derivative of "graphene"? :)



Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Radio
NEXT UPCOMING BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.
Like Us on Facebook
Special Video Section
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
10:35
The LTC®2983 measures a wide variety of temperature sensors ...
The LTC®3886 is a dual PolyPhase DC/DC synchronous ...
The LTC®2348-18 is an 18-bit, low noise 8-channel ...