Some of the TSV-related patents date back to 1980's so there would have to be some differences in the technology and the claims thereof in Silex patents on TSV. I am not familiar with Silex's claims, but I have a hunch it is very process-specific.
I'm wondering about the solidity of SILEX patents on this technology when I see the initial Thales patent on this TSV technology (« Method for producing via-connections in a substrate and substrate equipped with same » - WO 01/09944)...
Sil-Via is a via-first platform for MEMS development which has been in production for over five years. The license to Nanoshift allows them to offer this technology as a basis for prototyping work for their customers, instead of having to engage directly with Silex. Due to the R&D nature of much of MEMS, this type of move allows Silex to reach a much broader audience, and gives Nanoshift the ability to offer advanced packaging options to its customers with a much more seamless handoff back to Silex for production down the road.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.