Some of the TSV-related patents date back to 1980's so there would have to be some differences in the technology and the claims thereof in Silex patents on TSV. I am not familiar with Silex's claims, but I have a hunch it is very process-specific.
I'm wondering about the solidity of SILEX patents on this technology when I see the initial Thales patent on this TSV technology (« Method for producing via-connections in a substrate and substrate equipped with same » - WO 01/09944)...
Sil-Via is a via-first platform for MEMS development which has been in production for over five years. The license to Nanoshift allows them to offer this technology as a basis for prototyping work for their customers, instead of having to engage directly with Silex. Due to the R&D nature of much of MEMS, this type of move allows Silex to reach a much broader audience, and gives Nanoshift the ability to offer advanced packaging options to its customers with a much more seamless handoff back to Silex for production down the road.
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