Some of the TSV-related patents date back to 1980's so there would have to be some differences in the technology and the claims thereof in Silex patents on TSV. I am not familiar with Silex's claims, but I have a hunch it is very process-specific.
I'm wondering about the solidity of SILEX patents on this technology when I see the initial Thales patent on this TSV technology (« Method for producing via-connections in a substrate and substrate equipped with same » - WO 01/09944)...
Sil-Via is a via-first platform for MEMS development which has been in production for over five years. The license to Nanoshift allows them to offer this technology as a basis for prototyping work for their customers, instead of having to engage directly with Silex. Due to the R&D nature of much of MEMS, this type of move allows Silex to reach a much broader audience, and gives Nanoshift the ability to offer advanced packaging options to its customers with a much more seamless handoff back to Silex for production down the road.
NASA's Orion Flight Software Production Systems Manager Darrel G. Raines joins Planet Analog Editor Steve Taranovich and Embedded.com Editor Max Maxfield to talk about embedded flight software used in Orion Spacecraft, part of NASA's Mars mission. Live radio show and live chat. Get your questions ready.
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