Basically this is not a new idea and it ties the audio support into a chip not necessarily focused on audio. Such chips also tend to have less flexibility in support of the number of legacy audio interfaces.
For simple audio needs, it is fine. For rapidly evolving audio requirements (such as speaker array support, DSP effects, noise suppression and echo cancellation, a flexible dedicated audio chip is better, IMO.
TDSCDMA is a standard developed in China and the only major market for it right now is China. It originally was a way to get around the Qualcom CDMA patents and licenses needed if China wanted to produce their own cell phone IP.
Power Management along with Class-D amplifier is a very good idea so reduce the size of PCB, class D amplifier has become a necessity in all the phone due the requirement of speaker phone. This will also help in lowering the price in the competitive market.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.