Breaking News
Comments
Newest First | Oldest First | Threaded View
carolinesmith
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
carolinesmith   11/18/2012 6:33:20 PM
NO RATINGS
good questions, this is an interesting topic. http://www.uggcanadamart.com/

resistion
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
resistion   10/1/2012 7:50:24 AM
NO RATINGS
Must it be so thin?

ibm221
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
ibm221   12/5/2011 8:51:04 AM
NO RATINGS
yeah, it's doable, but how much would it cost?

DataMuncher
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
DataMuncher   12/5/2011 6:40:40 AM
NO RATINGS
Have seen a few things from Amkor on memory cubes using TSVs. I wonder how much wafer thinning needs to be done to produce these things. 128GB/s is incredible bandwidth, but 10micron thick, or should I say thinned, wafers are incredibly delicate. Test at all levels is also a crucial consideration, but I trust IBM more than most to do a good job.

ibm221
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
ibm221   12/5/2011 4:05:38 AM
NO RATINGS
HMC technology uses advanced TSVs — vertical conduits that electrically connect a stack of individual chips — to combine high-performance logic with Micron’s state-of-the-art DRAM. HMC delivers bandwidth and efficiencies a leap beyond current device capabilities. HMC prototypes, for example, clock in with bandwidth of 128 gigabytes per second (GB/s). By comparison, current state-of-the-art devices deliver 12.8 GB/s. HMC also requires 70 percent less energy to transfer data while offering a small form factor — just 10 percent of the footprint of conventional memory.

_hm
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
_hm   12/3/2011 2:07:08 AM
NO RATINGS
Can this be used to have large and fast memory in SoC solution - e.g. HD CMOS image sensor with HDMI output?

goafrit
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
goafrit   12/2/2011 4:31:20 PM
NO RATINGS
The same here - they need to share more so that folks can make sense of this

resistion
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
resistion   12/2/2011 3:40:13 PM
NO RATINGS
So far it looks pretty generic. Hope I can get something more from the talk.

ibm221
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
ibm221   12/2/2011 1:20:56 AM
NO RATINGS
anyone knows how much this would cost. $100 per piece?

chipmonk0
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
chipmonk0   12/1/2011 7:39:57 PM
NO RATINGS
This is a good match - because IBM has been working and publishing on 3D stacks using TSVs for at least the last 4 years and their technology would be at least on par with Samsung ( who have been demonstrating 3D DRAM stacks for the last 3 years ). Micron's recent overtures to Samsung is probably more for generating common standards - which is needed for wider adopton of this technology. IBM on the other hand would actually fab the controller chip for Micron's HMC module and might do the TSVs for Micro's DRAM and assemble the whole stack. What is not clear from this report though is if Micron has said anything so far about any long term association with IBM ( e,g. after a trial period license their process and then do HVM in house ? ) Anyone care to comment ? Phil ?



Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Radio
LATEST ARCHIVED BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

Brought to you by:

Like Us on Facebook
Special Video Section
In this short video we show an LED light demo to ...
02:46
Wireless Power enables applications where it is difficult ...
07:41
LEDs are being used in current luxury model automotive ...
With design sizes expected to increase by 5X through 2020, ...
01:48
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...