Embedded Systems Conference
Breaking News
Comments
Newest First | Oldest First | Threaded View
carolinesmith
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
carolinesmith   11/18/2012 6:33:20 PM
NO RATINGS
good questions, this is an interesting topic. http://www.uggcanadamart.com/

resistion
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
resistion   10/1/2012 7:50:24 AM
NO RATINGS
Must it be so thin?

ibm221
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
ibm221   12/5/2011 8:51:04 AM
NO RATINGS
yeah, it's doable, but how much would it cost?

DataMuncher
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
DataMuncher   12/5/2011 6:40:40 AM
NO RATINGS
Have seen a few things from Amkor on memory cubes using TSVs. I wonder how much wafer thinning needs to be done to produce these things. 128GB/s is incredible bandwidth, but 10micron thick, or should I say thinned, wafers are incredibly delicate. Test at all levels is also a crucial consideration, but I trust IBM more than most to do a good job.

ibm221
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
ibm221   12/5/2011 4:05:38 AM
NO RATINGS
HMC technology uses advanced TSVs — vertical conduits that electrically connect a stack of individual chips — to combine high-performance logic with Micron’s state-of-the-art DRAM. HMC delivers bandwidth and efficiencies a leap beyond current device capabilities. HMC prototypes, for example, clock in with bandwidth of 128 gigabytes per second (GB/s). By comparison, current state-of-the-art devices deliver 12.8 GB/s. HMC also requires 70 percent less energy to transfer data while offering a small form factor — just 10 percent of the footprint of conventional memory.

_hm
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
_hm   12/3/2011 2:07:08 AM
NO RATINGS
Can this be used to have large and fast memory in SoC solution - e.g. HD CMOS image sensor with HDMI output?

goafrit
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
goafrit   12/2/2011 4:31:20 PM
NO RATINGS
The same here - they need to share more so that folks can make sense of this

resistion
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
resistion   12/2/2011 3:40:13 PM
NO RATINGS
So far it looks pretty generic. Hope I can get something more from the talk.

ibm221
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
ibm221   12/2/2011 1:20:56 AM
NO RATINGS
anyone knows how much this would cost. $100 per piece?

chipmonk0
User Rank
Author
re: IBM, Micron to build hybrid memory with TSVs
chipmonk0   12/1/2011 7:39:57 PM
NO RATINGS
This is a good match - because IBM has been working and publishing on 3D stacks using TSVs for at least the last 4 years and their technology would be at least on par with Samsung ( who have been demonstrating 3D DRAM stacks for the last 3 years ). Micron's recent overtures to Samsung is probably more for generating common standards - which is needed for wider adopton of this technology. IBM on the other hand would actually fab the controller chip for Micron's HMC module and might do the TSVs for Micro's DRAM and assemble the whole stack. What is not clear from this report though is if Micron has said anything so far about any long term association with IBM ( e,g. after a trial period license their process and then do HVM in house ? ) Anyone care to comment ? Phil ?



Most Recent Comments
Radio
NEXT UPCOMING BROADCAST
Drones are, in essence, flying autonomous vehicles. Pros & cons surrounding drones today might well foreshadow the debate over the development of self-driving cars. In the context of a strongly regulated aviation industry, "self-flying" drones pose a fresh challenge. How safe is it to fly drones in different environments? Should drones be required for visual line of sight, as are piloted airplanes? Is the technology advancing faster than we can answer the questions it poses? Panelists: Chad Sweet, Director of Engineering, Qualcomm; Yannick Levy, VP Corporate Business Development, Parrot; Jim Williams, ex-FAA drone chief; Michael Drobac, Exec. Director, Small UAV Coalition; Moderator: Junko Yoshida, Chief Int'l Correspondent, EE Times
July 16, 1pm EDT Thursday
IoT Network Shoot Out
Top Comments of the Week
Flash Poll
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Special Video Section
LED lighting is an important feature in today’s and future ...
Active balancing of series connected battery stacks exists ...
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...