Embedded Systems Conference
Breaking News
Comments
Newest First | Oldest First | Threaded View
docdivakar
User Rank
Author
re: TSMC goes it alone with 3-D IC process
docdivakar   12/16/2011 6:20:43 PM
NO RATINGS
@ChrisGar: After the CMOS imaging Silicon heralded the way for 3D IC, DRAMs are the ones that are leading the way. WideIO 3D IC standards will be released very soon (stay tuned, there is an article on this by yours truly hitting the portal any minute today). The soon to be released JEDEC standard for this exclusively 3D, though 2.5D version is in the roadmap. This standard explicitly calls for post-stack assembly test enablement. MP Divakar

ChrisGar
User Rank
Author
re: TSMC goes it alone with 3-D IC process
ChrisGar   12/15/2011 3:09:39 PM
NO RATINGS
I'm surprised because it looks like DRAMs will be important for initial 3D IC products. TSMC must be planning to offer their DRAMs as the only DRAM solution for 3D ICs. Also, testing/DFT is important for 3D ICs. TSMC apparently is prepared to work with customers on test methodology to ensure yield can be optimized, yield learning, burn-in stress, etc.

chipmonk0
User Rank
Author
re: TSMC goes it alone with 3-D IC process
chipmonk0   12/14/2011 5:16:18 PM
NO RATINGS
I think that working with OSATs for the Xilinx 2.5 D module has probably provided TSMC a good gap and risk analyses. The technical drivers behind TSMC decision to do it all may be the fact that when it comes to resolving key integration issues e,g. chip package interaction, thin-wafer handling etc. TSMC probably has a lot more engineering resources than the OSATs themselves. If interested you can look up TSMC papers at recent IEEE - IITC conf. My question was more what are the global business scenario / tech. contingency ( e,g. trouble at 20 nm ) assumptions under which TSMC thinks this would be a viable alternative for them.

docdivakar
User Rank
Author
re: TSMC goes it alone with 3-D IC process
docdivakar   12/14/2011 4:49:28 PM
NO RATINGS
This is not encouraging for small companies and the startups that can innovate for 3DIC-enabled product innovations. @chipmonk: I am not sure if the business volume from 3DIC products coming TSMC's way (GloFo is actively working on this too!) is enough to offsest any debacles from TSMC's 20nm business. Certainly the announcement above doesn't encourage small companies to go TSMC's way for 3DIC business. I find the statement "Someone has to come forward to assume the responsibility..." amusing! This has been an on-going debate on who 'owns' the yield issues, reworks (if possible) and I don't believe it is going to be decided any time soon. MP Divakar

mlamorey
User Rank
Author
re: TSMC goes it alone with 3-D IC process
mlamorey   12/13/2011 10:43:49 PM
NO RATINGS
Customer are very apprehensive to go to market with a plan that involves brand new chip - chip - package interactions where ownership of issues and development overruns can be critical in time to market and success.

resistion
User Rank
Author
re: TSMC goes it alone with 3-D IC process
resistion   12/13/2011 10:17:14 PM
NO RATINGS
Maybe tsmc has to acquire a packaging company.

KB3001
User Rank
Author
re: TSMC goes it alone with 3-D IC process
KB3001   12/13/2011 9:28:15 PM
NO RATINGS
Bold move by TSMC.

chipmonk0
User Rank
Author
re: TSMC goes it alone with 3-D IC process
chipmonk0   12/13/2011 9:22:07 PM
NO RATINGS
The profit margin for packaging & assembly is just a fraction of that possible even for a Foundry like TSMC. So whats TSMCs motive to keep all 3D in - house and even cut off options by opting for via - first ? Is it just to prevent damage during xfer of partially processed wafers to the OSATs for assembly & damage caused by them to the thinned wafers ? What has been the experience during processing the 2.5D FPGAs for Xilinx ? Or is it more a business decision ? e,g. keeping everything inside a secret from nosey OSATs. This would only mean that TSMC is really banking on 3D stacking as a way to get off the Moore's Law treadmill in case their 20 nm bombs.



Most Recent Comments
Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

My Mom the Radio Star
Max Maxfield
Post a comment
I've said it before and I'll say it again -- it's a funny old world when you come to think about it. Last Friday lunchtime, for example, I received an email from Tim Levell, the editor for ...

Bernard Cole

A Book For All Reasons
Bernard Cole
1 Comment
Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
5 comments
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
Radio
LATEST ARCHIVED BROADCAST
EE Times Senior Technical Editor Martin Rowe will interview EMC engineer Kenneth Wyatt.
Flash Poll