What is discomforting is that the product announcements utilizing stacked 3DIC have all been from big companies like Samsung and Micron. The so called partnerships do not encourage smaller and/or startups to play thru product innovations. This has to change in the 3DIC game, otherwise, it is destined to become the play of a few big companies.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.