What is discomforting is that the product announcements utilizing stacked 3DIC have all been from big companies like Samsung and Micron. The so called partnerships do not encourage smaller and/or startups to play thru product innovations. This has to change in the 3DIC game, otherwise, it is destined to become the play of a few big companies.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.