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docdivakar
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re: Sematech identifies top tech challenges to 3-D ICs
docdivakar   12/28/2011 10:20:06 PM
NO RATINGS
What is discomforting is that the product announcements utilizing stacked 3DIC have all been from big companies like Samsung and Micron. The so called partnerships do not encourage smaller and/or startups to play thru product innovations. This has to change in the 3DIC game, otherwise, it is destined to become the play of a few big companies. MP Divakar



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