The only way way that this technology makes sense is if something needs to be field configured and there is no "soft" way to do it. I agree with DrQuine. The cost and extra space associated with the technology is likely better spent on redundancy or more robust technology that is likely to be lighter/more efficient.
Maybe they could somehow cause the ruptured microcapsules to also excrete some sort of florescent substances so that you could visually identify the area that was damaged once the machine/air/space vehicle returns for maintenance.
I think it is simpler than that. It is mentioned that the crack intercepts the capsules in that area and those capsules break open and repairs the crack. This good that the conductors could be repaired even when the system is not powered up. I wonder what metal are they using inside microcapsules.
Very interesting. This could have very wide-ranging applications and could revolutionize our ability to keep things functioning in isolated environments, or in hazardous environments. I hope this can be easily and economically employed.
We don't want to be "healing" into a different circuit configuration. How much additional space between conductive traces is required for self-healing circuits? Are there test protocols to ensure that the correct linkage has been restored?