Breaking News
Newest First | Oldest First | Threaded View
<<   <   Page 2 / 2
User Rank
re: Toyota accelerations revisited—hanging by a (tin) whisker
Etmax   1/11/2012 11:39:04 AM
Please don't forget that apart from needing almost twice the energy in production (I thought carbon emissions were to be avoided) lead free PCB's generally don't survive rework/repair due to copper migration from the PCB surface to the tin. This results in more scrap/waste. Also I have read that lead doesn't leach out of solder in land fill (one of the excuses for RoHS) and there has been no noticeable increase in lead levels of people performing materials recovery (the other excuse for RoHS) That said, many of the other substances banned under RoHS legislation are a problem and the world is better without them, eg. Chromium VI and Cadmium.

User Rank
re: Toyota accelerations revisited—hanging by a (tin) whisker
MN0   1/11/2012 10:15:07 AM
It's becoming increasingly obvious that the RoHS push for lead-free solder and platings was extremely poorly thought out. As well as the tin whisker problem, lead-free solder requires higher temperature soldering (putting more stress on components), and solder joints are much more likely to suffer mechanical fatigue. Just another example of environmentalists creating huge problems in the "real world".

User Rank
re: Toyota accelerations revisited—hanging by a (tin) whisker
eembedded_janitor   1/10/2012 9:56:59 PM
Faults like tin whiskers are exactly the reason why the pedal sensor has two pots. The values of the two pots are compared against an expected profile and if there is any discrepancy, the sensor is deemed to be faulty and power is limited to "limp home" mode. By the way, more modern sensors use hall effect sensing which is not prone to mechanical damage like pot wipers.

<<   <   Page 2 / 2 Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.
Most Recent Comments
Kevin Neilson
Susan Rambo
rick merritt
Like Us on Facebook
Special Video Section
LED lighting is an important feature in today’s and future ...
The LT8602 has two high voltage buck regulators with an ...
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
The LTC®2983 measures a wide variety of temperature sensors ...
The LTC®3886 is a dual PolyPhase DC/DC synchronous ...
The LTC®2348-18 is an 18-bit, low noise 8-channel ...
The LT®3042 is a high performance low dropout linear ...