Rather than using bumps to interconnect between substrates, why not use an anisotropic conductive film (ACF)? This would allow testing and rejection of any defective chips.
- Peter C. Salmon
A Book For All Reasons Bernard Cole1 Comment Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...