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Edmond1
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re: The Fast Track to 3D-IC Testing
Edmond1   10/30/2013 9:44:34 PM
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It seems plausible:

Consider an 8-layer die stack and a total of 40,000 interconnections:

1. What would ACF's conductive particle sizes be (7um +/- 1um diameter ) ?

2. The ACF adhesive film would have to highly engineered for viscosity flow and curability.

3. Bond force and wafer warpage would be tricky.

 

Upstream swimmer
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re: The Fast Track to 3D-IC Testing
Upstream swimmer   1/17/2012 5:24:27 PM
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Rather than using bumps to interconnect between substrates, why not use an anisotropic conductive film (ACF)? This would allow testing and rejection of any defective chips. - Peter C. Salmon peter@petersalmon.com



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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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