Rather than using bumps to interconnect between substrates, why not use an anisotropic conductive film (ACF)? This would allow testing and rejection of any defective chips.
- Peter C. Salmon
The Other Tesla David Blaza5 comments I find myself going to Kickstarter and Indiegogo on a regular basis these days because they have become real innovation marketplaces. As far as I'm concerned, this is where a lot of cool ...