Rather than using bumps to interconnect between substrates, why not use an anisotropic conductive film (ACF)? This would allow testing and rejection of any defective chips.
- Peter C. Salmon
NASA's Orion Flight Software Production Systems Manager Darrel G. Raines joins Planet Analog Editor Steve Taranovich and Embedded.com Editor Max Maxfield to talk about embedded flight software used on the Mars on EE Times Radio. Live radio show and live chat. Get your questions ready.