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KB3001
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re: TSMC process in trouble, says analyst
KB3001   1/21/2012 10:48:20 AM
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While problematic, TSMC have enough of a capital cushion to withstand such losses.

KB3001
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re: TSMC process in trouble, says analyst
KB3001   1/21/2012 10:46:38 AM
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It's not as big a threat perhaps but very close indeed.

seaEE
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re: TSMC process in trouble, says analyst
seaEE   1/21/2012 2:21:46 AM
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Moore meets his friend Murphy.

_hm
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re: TSMC process in trouble, says analyst
_hm   1/21/2012 1:26:47 AM
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I would like to know specific faced by TSMC. They may soon resolve problem and aim for 22nm.

DF0
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re: TSMC process in trouble, says analyst
DF0   1/20/2012 11:27:45 PM
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Well, if TSMC can't make a lot of good 28nm dice, then that probably explains why AMD's cancelled most of their 28nm Fusion products (Deccan/Wichita, etc.). Better to use them to make high ASP GPUs than low-ASP APUs.

mike655mm
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re: TSMC process in trouble, says analyst
mike655mm   1/20/2012 10:54:41 PM
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450mm is a cost reduction measure that squeezes more die on a wafer. It has nothing to do with "technology" leadership. It's the transistor dimensions and die size that are important. 22nm & 14nm will be on 300mm before they bring up 450mm.

the_floating_ gate
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re: TSMC process in trouble, says analyst
the_floating_ gate   1/20/2012 7:23:52 PM
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Apple picked up a "ton" of WiFi related IP from Freescale over the last six months or so - obviously it's patented but would you be comfortable to disclose this kind of knowledge with someone like Samsung who is direct competitor? I certainly would not. Jun 6, 2011 – Intel CFO Stacy Smith is on record saying that combining other chip design IPs with Intel's architecture core "would be fantastic business for us. ...

Lsweep
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re: TSMC process in trouble, says analyst
Lsweep   1/20/2012 6:19:02 PM
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Time for Apple to engage with Intel re mobile?

the_floating_ gate
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re: TSMC process in trouble, says analyst
the_floating_ gate   1/20/2012 5:29:04 PM
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"People whine about foreign oil but foreign monopoly on chip production is just as big a threat." You make an excellent point; I believe INTC's (surprise) increase in capex is probably geared towards 450 mm wafer processing and quoting the "Godfather" Intel might make Apple an offer they can not resist. 2011 was very unique year exposing risks related to offshore outsourcing. I can think of Apple and Intel working together to create a best of breed SoC (manufactured at 450 mm). IMHO too many US based fabless chipmakers are competing for advanced technology capacity. An usually a foundry process is more or less a one size fits all process - it's probably good but not as perfect as it could be finetuning all parameters for one specific customer. Yield data is usually top secret info but TSMC is ramping up BIG time (for TSMC standard) in Q1 2012 - however TSMC added almost no additional 300 mm capacity in second half of 2011 according to TSMC quarterly report: According to latest quarterly report TSMC added 92 units of 300 mm wafer starts in 2011; in Q1 2012 alone TSMC is adding 71 units of 300 mm wafer starts (Fab 12, Fab 14). So TSMC is playing catch up but according to ASML who keeps excellent track of what is going on at customer base TSMC's capacity additions for 28nm are far away from what would be required to make 28nm main stream. So I would not write off TSMC prematurely but I just can't see someone like Apple continue to depend on TSMC when 450 mm becomes mainstream. And Samsung is becoming more and more a competitor for Apple.

me3
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re: TSMC process in trouble, says analyst
me3   1/20/2012 4:28:27 PM
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They are not in trouble as long as there is no REAL alternatives. People whine about foreign oil but foreign monopoly on chip production is just as big a threat.

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