Design Con 2015
Breaking News
Comments
Newest First | Oldest First | Threaded View
Page 1 / 3   >   >>
PV-Geek
User Rank
Rookie
re: TSMC process in trouble, says analyst
PV-Geek   2/11/2012 10:02:44 PM
NO RATINGS
Regardless of the truth of the details, 28nm has been a real challenge, particularly in the initial ramp up phase. This is more sanely evidenced in the increasing amount of DFM activities being pushed to the designer at these nodes. Things like litho checking, smart fill, pattern based checks, and restricted design rule checks have migrated from recommended to required. This is evidence enough that many of the second and third order effects on yield are becoming first order. Strict adherence and effort spent optimizing these DFM issues in the design phase is probably what is causing such different results on different chips. All designs are not the same from a DFM perspective.

Robotics Developer
User Rank
Rookie
re: TSMC process in trouble, says analyst
Robotics Developer   1/26/2012 12:14:26 AM
NO RATINGS
It sounds like there is no clear story here, one says no yield and another says on target for defect density. It could mean the 0% yield is on track with what they expect for defects at this point. I am sure that they are closing guarding the real numbers. Only time will tell, I am rooting for success as it can only help drive costs down overall in the market.

IFTLE
User Rank
Rookie
re: TSMC process in trouble, says analyst
IFTLE   1/24/2012 8:51:22 PM
NO RATINGS
Anyone know whether the Samsung is designing the A6 with 3D and TSV or not. Supposedly the 28 nm respin by TSMC was to incorporate this. Is Samsung doing the same ??

cxy11
User Rank
Rookie
re: TSMC process in trouble, says analyst
cxy11   1/24/2012 7:57:45 AM
NO RATINGS
Interesting comments: TSMC 28nm Yield called into question? Again? Really? http://www.semiwiki.com/forum/f2/tsmc-28nm-yield-called-into-question-again-really-1264.html

chipmonk0
User Rank
Manager
re: TSMC process in trouble, says analyst
chipmonk0   1/23/2012 6:41:30 PM
NO RATINGS
Samsung stays ahead of TSMC in this regard because they always start a new node with memory before going to processors. For memory Samsung is already at 20 nm. Samsung's A6 for Apple is already at 28 nm ( only in Austin, NOT So. Korea ) In the last few years TSMC has come through as being a little too cocky about their market share and at Technical Conferences sounded almost "Big Brother" ish. Samsung's spending of 10s of billion $ in 2012 does not bode well for TSMC lead in Foundry. In fact TSMC is already out in the public back pedalling on their CapEx siting low growth in demand. What happens now if nVidia or even Qualcomm ( current large customers of TSMC ) now jump ship ( Samsung, even Intel ?? ) in order to stay competitive with A6 Quad Core ?

Oscar Law
User Rank
Rookie
re: TSMC process in trouble, says analyst
Oscar Law   1/23/2012 3:28:24 PM
NO RATINGS
Since most of the large fabless companies are satisfied with TSMC 28nm process, the low yield issues of some companies are potentially due to design related process issues. It can be fixed by design/process expert after review the layout.

resistion
User Rank
CEO
re: TSMC process in trouble, says analyst
resistion   1/23/2012 1:52:41 PM
NO RATINGS
It looks like xilinx was really happy with tsmc 28 nm, so it's probably rushed designs that's the problem. http://www.electronicsweekly.com/blogs/david-manners-semiconductor-blog/2011/11/will-28nm-be-a-good-node.html

mranderson
User Rank
Rookie
re: TSMC process in trouble, says analyst
mranderson   1/23/2012 4:28:47 AM
NO RATINGS
I think we may potentially see many fabless semiconductor companies talk about moving to UMC and/or Samsung for 22nm if TSMC has a setback at 28nm. But much of this will be idle talk to try and get TSMC to lower prices since nobody else has enough production capacity at this point. Most 28nm designs simply are not ready for production level tapeout since the process and IP are immature for 2011 and 2012. I suspect much blame also resides within TSMC's customers for the failure since just about everyone does test chips on new processes for characterization before launching production designs.

andyroyduh
User Rank
Rookie
re: TSMC process in trouble, says analyst
andyroyduh   1/21/2012 8:57:46 PM
NO RATINGS
No mention of UMC 28nm in this article, but EE Times article from last year indicated TI using UMC as their lead foundry for 28nm. I assume other chip companies have similar multi-source foundry strategies. http://www.eetimes.com/electronics-news/4214774/Upset-TI-slams-Samsung-s-foundry-efforts It will be interesting to see which foundry can work out thier 28nm yield issues first and how this translates to application processor and GPU market share in 2013. Andy

me3
User Rank
Rookie
re: TSMC process in trouble, says analyst
me3   1/21/2012 3:38:42 PM
NO RATINGS
"While problematic, TSMC have enough of a capital cushion to withstand such losses." That is the problem. The big three have enough capital cushion for anything. They have no need for innovation except for their own. You have to turn to FTC to get anything, like in the Univ. of New Mexico vs. TSMC case. It is killing the ecosystem.

Page 1 / 3   >   >>


Top Comments of the Week
Flash Poll
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Recommended Reads From the Engineer's Bookshelf
Max Maxfield
2 comments
I'm not sure if I read more than most folks or not, but I do I know that I spend quite a lot of time reading. I hate to be idle, so I always have a book or two somewhere about my person -- ...

Aubrey Kagan

Have You Ever Been Blindsided by Your Own Design?
Aubrey Kagan
37 comments
I recently read GCHQ: The uncensored story of Britain's most sensitive intelligence agency by Richard J. Aldrich. The Government Communication Headquarters (GCHQ), Britain's equivalent of ...

Martin Rowe

No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
2 comments
American Thanksgiving is next week, and while some people watch (American) football all day, the real competition on TV has become Punkin Chunkin. But there will be no Punkin Chunkin on TV ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
15 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
Doug Bailey, VP of marketing at Power Integrations, gives a ...
See how to ease software bring-up with DesignWare IP ...
DesignWare IP Prototyping Kits enable fast software ...
This video explores the LT3086, a new member of our LDO+ ...
In today’s modern electronic systems, the need for power ...