Well, if TSMC can't make a lot of good 28nm dice, then that probably explains why AMD's cancelled most of their 28nm Fusion products (Deccan/Wichita, etc.). Better to use them to make high ASP GPUs than low-ASP APUs.
450mm is a cost reduction measure that squeezes more die on a wafer. It has nothing to do with "technology" leadership. It's the transistor dimensions and die size that are important. 22nm & 14nm will be on 300mm before they bring up 450mm.
Apple picked up a "ton" of WiFi related IP from Freescale over the last six months or so - obviously it's patented but would you be comfortable to disclose this kind of knowledge with someone like Samsung who is direct competitor?
I certainly would not.
Jun 6, 2011 – Intel CFO Stacy Smith is on record saying that combining other chip design IPs with Intel's architecture core "would be fantastic business for us. ...
"People whine about foreign oil but foreign monopoly on chip production is just as big a threat."
You make an excellent point; I believe INTC's (surprise) increase in capex is probably geared towards 450 mm wafer processing and quoting the "Godfather" Intel might make Apple an offer they can not resist. 2011 was very unique year exposing risks related to offshore outsourcing.
I can think of Apple and Intel working together to create a best of breed SoC (manufactured at 450 mm). IMHO too many US based fabless chipmakers are competing for advanced technology capacity. An usually a foundry process is more or less a one size fits all process - it's probably good but not as perfect as it could be finetuning all parameters for one specific customer.
Yield data is usually top secret info but TSMC is ramping up BIG time (for TSMC standard) in
Q1 2012 - however TSMC added almost no additional 300 mm capacity in second half of 2011 according to TSMC quarterly report:
According to latest quarterly report TSMC added 92 units of 300 mm wafer starts in 2011; in Q1 2012 alone TSMC is adding 71 units of 300 mm wafer starts (Fab 12, Fab 14).
So TSMC is playing catch up but according to ASML who keeps excellent track of what is going on at customer base TSMC's capacity additions for 28nm are far away from what would be required to make 28nm main stream.
So I would not write off TSMC prematurely but I just can't see someone like Apple continue to depend on TSMC when 450 mm becomes mainstream.
And Samsung is becoming more and more a competitor for Apple.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.