Design Con 2015
Breaking News
Newest First | Oldest First | Threaded View
<<   <   Page 2 / 2
User Rank
re: Wanted: 3-D IC standards within six months
chipmonk0   2/1/2012 11:04:00 AM
Like every other disruptive technology before it, the development and implementation of 3D stacks using TSVs too will follow the path of least resistance and maximum need / profit margin. Thus the next major application for 3D TSVs would most likely be just memory ( DRAM ) at bandwidths greatly increased by 3D stacking so the memory bottleneck in multi - core processors can be eliminated along with the power wasted due to long interconnect lengths. Servers are waiting for just such memory. I would be very surpised if despite all the hoopla & urgency expressed in this report memory / CPU modules using 3D stacks w/ TSVs appear in smartphones anytime soon. Less radical / risky integration schemes can deliver the bandwidth required for real time video. Unless of course fabless market leaders in ARM based processors are scared of getting upstaged by Samsung, which has built 3D memory w/ TSV and can integrate them more easily to their own ARM based processor in their own Fab.

rick merritt
User Rank
re: Wanted: 3-D IC standards within six months
rick merritt   2/1/2012 4:14:26 AM
I'm thinking this is the future of system design. Anybody else?

User Rank
re: Wanted: 3-D IC standards within six months
GREAT-Terry   2/1/2012 3:52:06 AM
With 3D IC design flow being standardized, will the whole industry be revolutionized?

<<   <   Page 2 / 2

Top Comments of the Week
Flash Poll
Like Us on Facebook Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Carlos Bueno

Adventures in Userland
Carlos Bueno
Post a comment
Editor’s Note: Excerpted from Lauren Ipsum: A story about computer science and other improbable things, author Carlos Bueno introduces us to Lauren and her adventures in ...

Max Maxfield

Tired Old iPad 2 vs. Shiny New iPad Air 2
Max Maxfield
I remember when the first iPad came out deep in the mists of time we used to call 2010. Actually, that's only four years ago, but it seems like a lifetime away -- I mean; can you remember ...

Martin Rowe

Make This Engineering Museum a Reality
Martin Rowe
Post a comment
Vincent Valentine is a man on a mission. He wants to make the first house to ever have a telephone into a telephone museum. Without help, it may not happen.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
Doug Bailey, VP of marketing at Power Integrations, gives a ...
See how to ease software bring-up with DesignWare IP ...
DesignWare IP Prototyping Kits enable fast software ...
This video explores the LT3086, a new member of our LDO+ ...
In today’s modern electronic systems, the need for power ...