Like every other disruptive technology before it, the development and implementation of 3D stacks using TSVs too will follow the path of least resistance and maximum need / profit margin.
Thus the next major application for 3D TSVs would most likely be just memory ( DRAM ) at bandwidths greatly increased by 3D stacking so the memory bottleneck in multi - core processors can be eliminated along with the power wasted due to long interconnect lengths. Servers are waiting for just such memory.
I would be very surpised if despite all the hoopla & urgency expressed in this report memory / CPU modules using 3D stacks w/ TSVs appear in smartphones anytime soon. Less radical / risky integration schemes can deliver the bandwidth required for real time video.
Unless of course fabless market leaders in ARM based processors are scared of getting upstaged by Samsung, which has built 3D memory w/ TSV and can integrate them more easily to their own ARM based processor in their own Fab.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.