Design Con 2015
Breaking News
Comments
Newest First | Oldest First | Threaded View
Page 1 / 2   >   >>
snake123
User Rank
Rookie
re: Wanted: 3-D IC standards within six months
snake123   8/30/2013 3:10:10 AM
NO RATINGS
As your one-stop online store, we supply thousands of high-quality rc helicopters,rc airplanes, and more, all at exceptional prices, and with Cheapest Shipping Fee! Experience professional service and buy high quality made-in-China RC today.
Registering only takes a few seconds and is free, after which you'll have your own brand-new shopping cart to fill with all the goods that you want! All you need to get started is a valid email address. Start buying online and grab your RC today!
Get your rc products with diverse shipping method all over the world! You can now buy cool RC at very low prices with no additional costs! Browse our huge range of products now and see by yourself.
Dynam "I can Fly"


RCTOPHOBBY.com's Fast Delivery is well known to all. Place your order, make a payment, and your products will arrive within 7 days once shipped. Order your cool RC today!

owen914
User Rank
Rookie
re: Wanted: 3-D IC standards within six months
owen914   6/22/2013 2:52:09 AM
NO RATINGS
There is a "temptation" on the part of Foundries to sidestep yield issues at 28 nm by going back to say 45 nm and partition the SoCs into several layers and then connect them with TSV. http://www.rctophobby.com/rc-helicopters/rc-helicopter-parts.html Samsung on the other hand I believe is off and running in Austin at 28 nm for A6.

resistion
User Rank
CEO
re: Wanted: 3-D IC standards within six months
resistion   4/28/2013 2:42:49 PM
NO RATINGS
Will Apple go to TSMC for 20 nm and TSV? TSMC too popular at 28 nm.

Astier
User Rank
Rookie
re: Wanted: 3-D IC standards within six months
Astier   4/28/2013 9:26:23 AM
NO RATINGS
I believe is off and running in Austin at 28 nm for A6. http://www.rctophobby.com/fr/rc-helicopteres/achete-par-marque/walkera.html

Astier
User Rank
Rookie
re: Wanted: 3-D IC standards within six months
Astier   4/28/2013 9:24:53 AM
NO RATINGS
I believe is off and running in Austin at 28 nm for A6. http://www.rctophobby.com/fr/rc-helicopteres/achete-par-marque/walkera.html

docdivakar
User Rank
CEO
re: Wanted: 3-D IC standards within six months
docdivakar   2/7/2012 6:04:41 PM
NO RATINGS
@chipmonk: on the contrary, lack of real estate is one of the major drivers for stacking in smartphones. On your last point, Micron is part of the Hybrid Memorycube consortium: http://www.hybridmemorycube.org/ Samsung is also a (founding?) member. MP Divakar

docdivakar
User Rank
CEO
re: Wanted: 3-D IC standards within six months
docdivakar   2/7/2012 5:59:50 PM
NO RATINGS
@rick.merritt: assuming your'system' definition refers to a product serving homogeneous or heterogeneous functions while utilizing 2.5D/3D stacking, it will be the future of that system's design. But I would argue that that its function, whether partial or in full, must be complemented by the appropriate value addition in software. That, I believe, is the next generation of 'ASIC' startups! MP Divakar

chipmonk0
User Rank
Manager
re: Wanted: 3-D IC standards within six months
chipmonk0   2/3/2012 7:13:28 PM
NO RATINGS
I "feel" that the Apple vs Samsung tangle could turn out to be one of the biggest factors in how 3D TSV implementation and TSMC comes out in the Smartphone segment. There is a "temptation" on the part of Foundries to sidestep yield issues at 28 nm by going back to say 45 nm and partition the SoCs into several layers and then connect them with TSV. Samsung on the other hand I believe is off and running in Austin at 28 nm for A6. Re: connecting Memory to APs by TSVs,the bandwidth needs would not become acute for a couple of years.

IFTLE
User Rank
Rookie
re: Wanted: 3-D IC standards within six months
IFTLE   2/2/2012 3:07:41 PM
NO RATINGS
what about the rumors that TSMC is doing a respin o nthe Apple A6 sothat it can incorporate TSV ? Don't you think this would be an industry driver as well ?

resistion
User Rank
CEO
re: Wanted: 3-D IC standards within six months
resistion   2/1/2012 4:53:56 PM
NO RATINGS
Remember seeing a wafer thinned for TSVs that was essentially semitransparent and very breakable.The silicon sheet resistance definitely goes up as well.

Page 1 / 2   >   >>


Top Comments of the Week
Flash Poll
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Recommended Reads From the Engineer's Bookshelf
Max Maxfield
2 comments
I'm not sure if I read more than most folks or not, but I do I know that I spend quite a lot of time reading. I hate to be idle, so I always have a book or two somewhere about my person -- ...

Aubrey Kagan

Have You Ever Been Blindsided by Your Own Design?
Aubrey Kagan
37 comments
I recently read GCHQ: The uncensored story of Britain's most sensitive intelligence agency by Richard J. Aldrich. The Government Communication Headquarters (GCHQ), Britain's equivalent of ...

Martin Rowe

No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
2 comments
American Thanksgiving is next week, and while some people watch (American) football all day, the real competition on TV has become Punkin Chunkin. But there will be no Punkin Chunkin on TV ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
15 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
Doug Bailey, VP of marketing at Power Integrations, gives a ...
See how to ease software bring-up with DesignWare IP ...
DesignWare IP Prototyping Kits enable fast software ...
This video explores the LT3086, a new member of our LDO+ ...
In today’s modern electronic systems, the need for power ...