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snake123
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re: Wanted: 3-D IC standards within six months
snake123   8/30/2013 3:10:10 AM
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owen914
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re: Wanted: 3-D IC standards within six months
owen914   6/22/2013 2:52:09 AM
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There is a "temptation" on the part of Foundries to sidestep yield issues at 28 nm by going back to say 45 nm and partition the SoCs into several layers and then connect them with TSV. http://www.rctophobby.com/rc-helicopters/rc-helicopter-parts.html Samsung on the other hand I believe is off and running in Austin at 28 nm for A6.

resistion
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re: Wanted: 3-D IC standards within six months
resistion   4/28/2013 2:42:49 PM
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Will Apple go to TSMC for 20 nm and TSV? TSMC too popular at 28 nm.

Astier
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re: Wanted: 3-D IC standards within six months
Astier   4/28/2013 9:26:23 AM
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I believe is off and running in Austin at 28 nm for A6. http://www.rctophobby.com/fr/rc-helicopteres/achete-par-marque/walkera.html

Astier
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re: Wanted: 3-D IC standards within six months
Astier   4/28/2013 9:24:53 AM
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I believe is off and running in Austin at 28 nm for A6. http://www.rctophobby.com/fr/rc-helicopteres/achete-par-marque/walkera.html

docdivakar
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re: Wanted: 3-D IC standards within six months
docdivakar   2/7/2012 6:04:41 PM
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@chipmonk: on the contrary, lack of real estate is one of the major drivers for stacking in smartphones. On your last point, Micron is part of the Hybrid Memorycube consortium: http://www.hybridmemorycube.org/ Samsung is also a (founding?) member. MP Divakar

docdivakar
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re: Wanted: 3-D IC standards within six months
docdivakar   2/7/2012 5:59:50 PM
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@rick.merritt: assuming your'system' definition refers to a product serving homogeneous or heterogeneous functions while utilizing 2.5D/3D stacking, it will be the future of that system's design. But I would argue that that its function, whether partial or in full, must be complemented by the appropriate value addition in software. That, I believe, is the next generation of 'ASIC' startups! MP Divakar

chipmonk0
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re: Wanted: 3-D IC standards within six months
chipmonk0   2/3/2012 7:13:28 PM
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I "feel" that the Apple vs Samsung tangle could turn out to be one of the biggest factors in how 3D TSV implementation and TSMC comes out in the Smartphone segment. There is a "temptation" on the part of Foundries to sidestep yield issues at 28 nm by going back to say 45 nm and partition the SoCs into several layers and then connect them with TSV. Samsung on the other hand I believe is off and running in Austin at 28 nm for A6. Re: connecting Memory to APs by TSVs,the bandwidth needs would not become acute for a couple of years.

IFTLE
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re: Wanted: 3-D IC standards within six months
IFTLE   2/2/2012 3:07:41 PM
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what about the rumors that TSMC is doing a respin o nthe Apple A6 sothat it can incorporate TSV ? Don't you think this would be an industry driver as well ?

resistion
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CEO
re: Wanted: 3-D IC standards within six months
resistion   2/1/2012 4:53:56 PM
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Remember seeing a wafer thinned for TSVs that was essentially semitransparent and very breakable.The silicon sheet resistance definitely goes up as well.

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