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adelestuart
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re: TSMC plans 3-D IC assembly launch early in 2013
adelestuart   6/28/2013 10:11:42 AM
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docdivakar
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re: TSMC plans 3-D IC assembly launch early in 2013
docdivakar   2/6/2012 5:54:56 PM
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TSMC will eventually win given its high volume history with big chip companies. One stop is convenient for these types of businesses and what TSMC is offering makes sense. How ever, I don't think this bodes well for smaller companies and startups of tomorrow who can really innovate with applications and required processors enabled by 3D stacking. They may not have the volumes high enough to be even get their emails replied to by TSMC! MP Divakar

resistion
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re: TSMC plans 3-D IC assembly launch early in 2013
resistion   2/5/2012 8:48:39 AM
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Indeed, a one-stop shop that only Samsung has achieved has the most leverage for 3D. They trumped tsmc and Intel.

goafrit
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re: TSMC plans 3-D IC assembly launch early in 2013
goafrit   2/3/2012 9:54:10 PM
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TSMC seems to have a lot of cash to cushion this type of investment when 3D is not necessarily certain.

chipmonk0
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CEO
re: TSMC plans 3-D IC assembly launch early in 2013
chipmonk0   2/3/2012 6:43:39 PM
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TSMC has to compete against Samsung which already holds many of the cards Samsung might come out the big winner in the 3D wars ! To gain the most ( speed, power saving, cost ) out of the pain involved in 3D TSV, co-ordination of die floor - plans for shortest interconnect length would be critical. Samsung can control everything themselves. They already - fab APs for Apple ( A... A6 ) now at 28 nm - design and build their own ARM based APs - have 40 % market share in DRAM ( down to 30 nm ) and NAND ( 20 nm ) - showed a year ago REAL 3-D memory stacks( not vaporware or computer graphics, unlike some other claims ), complete w/ bandwidth measurements & SEMs of x - section ) - builds their own substrates etc. etc. Fabless wonders who depend on TSMC for high margins and market share in the Smart Phone / Tablet segment might be sweating.

greenpattern
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Rookie
re: TSMC plans 3-D IC assembly launch early in 2013
greenpattern   2/3/2012 2:53:00 PM
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What if a DRAM vendor wants to assemble the 3D on top of a TSMC part. Will TSMC be ok with that?



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