Breaking News
Comments
greenpattern
User Rank
Rookie
re: TSMC plans 3-D IC assembly launch early in 2013
greenpattern   2/3/2012 2:53:00 PM
NO RATINGS
What if a DRAM vendor wants to assemble the 3D on top of a TSMC part. Will TSMC be ok with that?

chipmonk0
User Rank
Manager
re: TSMC plans 3-D IC assembly launch early in 2013
chipmonk0   2/3/2012 6:43:39 PM
NO RATINGS
TSMC has to compete against Samsung which already holds many of the cards Samsung might come out the big winner in the 3D wars ! To gain the most ( speed, power saving, cost ) out of the pain involved in 3D TSV, co-ordination of die floor - plans for shortest interconnect length would be critical. Samsung can control everything themselves. They already - fab APs for Apple ( A... A6 ) now at 28 nm - design and build their own ARM based APs - have 40 % market share in DRAM ( down to 30 nm ) and NAND ( 20 nm ) - showed a year ago REAL 3-D memory stacks( not vaporware or computer graphics, unlike some other claims ), complete w/ bandwidth measurements & SEMs of x - section ) - builds their own substrates etc. etc. Fabless wonders who depend on TSMC for high margins and market share in the Smart Phone / Tablet segment might be sweating.

resistion
User Rank
CEO
re: TSMC plans 3-D IC assembly launch early in 2013
resistion   2/5/2012 8:48:39 AM
NO RATINGS
Indeed, a one-stop shop that only Samsung has achieved has the most leverage for 3D. They trumped tsmc and Intel.

goafrit
User Rank
Manager
re: TSMC plans 3-D IC assembly launch early in 2013
goafrit   2/3/2012 9:54:10 PM
NO RATINGS
TSMC seems to have a lot of cash to cushion this type of investment when 3D is not necessarily certain.

docdivakar
User Rank
Manager
re: TSMC plans 3-D IC assembly launch early in 2013
docdivakar   2/6/2012 5:54:56 PM
NO RATINGS
TSMC will eventually win given its high volume history with big chip companies. One stop is convenient for these types of businesses and what TSMC is offering makes sense. How ever, I don't think this bodes well for smaller companies and startups of tomorrow who can really innovate with applications and required processors enabled by 3D stacking. They may not have the volumes high enough to be even get their emails replied to by TSMC! MP Divakar

adelestuart
User Rank
Rookie
re: TSMC plans 3-D IC assembly launch early in 2013
adelestuart   6/28/2013 10:11:42 AM
NO RATINGS
it will be perfect to apply it in 2013 http://www.yachtbooker.com/Yacht-Charter-majorca-palma-de-mallorca.html



Flash Poll
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Engineer's Bookshelf
Caleb Kraft

The Martian: A Delightful Exploration of Math, Mars & Feces
Caleb Kraft
3 comments
To say that Andy Weir's The Martian is an exploration of math, Mars, and feces is a slight simplification. I doubt that the author would have any complaints, though.

The Engineering Life - Around the Web
Caleb Kraft

Surprise TOQ Teardown at EELive!
Caleb Kraft
Post a comment
This year, for EELive! I had a little surprise that I was quite eager to share. Qualcomm had given us a TOQ smart watch in order to award someone a prize. We were given complete freedom to ...

Design Contests & Competitions
Caleb Kraft

Join The Balancing Act With April's Caption Contest
Caleb Kraft
54 comments
Sometimes it can feel like you're really performing in the big tent when presenting your hardware. This month's caption contest exemplifies this wonderfully.

Engineering Investigations
Caleb Kraft

Frankenstein's Fix: The Winners Announced!
Caleb Kraft
8 comments
The Frankenstein's Fix contest for the Tektronix Scope has finally officially come to an end. We had an incredibly amusing live chat earlier today to announce the winners. However, we ...

Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)