Renesas recently advocated TSV technology for DRAM with mobile SOC's. If the rumor is correct, it's going to get spun off as well. Yet another example the adoption of new technology like TSV is suffering from consolidation.
ST-E is not looking good at the moment especially considering the mega-merge happened even earlier than the formation of Renesas Electronics in Apr2010. With the engineering teams, presumably coming with the relevant IPs, from EMP, Nokia, Philips, STM, shouldn't ST-E have the most IPR, even more than Qualcomm? If so, this is a huge competitive edge. So far, they are not winning the AP/Integration race in leaps and bounds ...
I'm a bit wary of three-way mergers; just look at ST-Ericsson! (OK they have other problems in addition) and GlobalFoundries doesn't look like a massive success at this point either. Any more word on Elpida's possible involvement?
I agree the consolidation is not just a rumor but will happen very probably.
An important aspect of this move is that Japanese auto makers including Toyota and Nissan support or possibly request it. Using the leading-edge electronics technologies is critical for the success of EVs/HVs and the 3 chip makers have been providing custom LSIs as key parts.
As long as the combined entity, if happened, does not prune the products which have very little chance to be #2 or #3, together with the related human resources, the merge can only prolong when the eventual demise is going to happen.
The involvement of Globalfoundries and the proposed manufacturing JV is the most interesting aspect of this deal to me. Assuming that the Nikkei report is accurate, I would be very interested to see how they will structure such a deal and how the manufacturing JV will be able to turn a profit.
Intellectually and strategically, it makes sense for Japan to combine Renessas, Panasonic and Fujitsu chip manufacturing into one entity. After all, it is difficult for individual companies (except Intel) to keep up with fab innovations due to costs. Organizationally, it seems it will be difficult...perhaps that is why they brought in Global Foundries into the deal. At best, it will take time to merge these manufacturing units effectively. I think this will make Japan IC chips more of a captive market within its own systems divisions. Steve Szirom, InsideChips.com.
I agree that Toshiba is generally doing better than other Japanese semis mainly due to the volume of NAND flash coming out of it's massive Yokkaichi complex, which has been built out in partnership with SanDisk. This economy of scale helps support the non memory parts of Toshiba's semi operations.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.