It's just that I wanted to focus on SoCs in this particular article. Otherwise, in the book "Smartphone," for this integration marvel, I have mentioned SiP along with SoC. I have also listed memory stacks and dense PCBs as other critical factors.
With SiP, you need to wait for all two or three chips to arrive, but with SoC they effectively all arrive at once. But if the same company makes all two or three chips as different high-volume product lines already, that company usually prefers SiP.
An SoC can have many devices into one single piece. This is a key phase for miniaturization. Simply said, the embedded and portable technology couldn’t be real if it weren’t for the SoC’s.
You can’t have the software without the adequate hardware. Perhaps you could have the great ideas for the product, but if the hardware doesn’t have what it takes, the good ideas wouldn’t become reality.
One truth thing about software that makes it perhaps slightly over hardware is the versatility of software. In the same hardware you can re-program the chip to implement a whole plethora of ideas. And most of the times you can’t do that with hardware.
The Other Tesla David Blaza5 comments I find myself going to Kickstarter and Indiegogo on a regular basis these days because they have become real innovation marketplaces. As far as I'm concerned, this is where a lot of cool ...