Another interesting development last week relative to K3V2 is Microsoft adding Huawei to the Windows 8 on ARM program:
Nvidia does have an ARM architectural license, but it hasn't made use of it yet. Tegra3 was made in a 40nm high performance process at TSMC. Huawei's K3V2 was made in a 40 nm low power process at TSMC.
With the availabilty of so much of the IP - A9 processors from ARM, GPU from the unnamed partner in the US, "designing" such an SoC is not such a big deal as it used to be a few years back.
For these applications the power efficiency is key - fps alone does not matter - a xeon gets better fps e.g.
BUT I believe this will enable Huawei to do what it has done in the other markets - lower the price of its handsets to a price-point that cannot be touched by anyone else since they now control the silicon as well and do not need to pay a TI or nVidia margins.
It will take them a few generations but they will eventually get it right. Be scared, be very scared.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.