Why is it surprising? The new finfet technology is such a radical departure from previous tick-tock shrinks that some hiccup is to be expected.
The very original timelines had Ivy Bridge introductions in Q4 11/Q1 12 timeframe, so that would amount to a glitch. Even the mighty Intel is not immune to the challenges of very deep submicron manufacturing. Note this is not a few working die to characterize for publications - this is shipping in volume with the yields that the business is based on - a big difference.
Jim McGregor of In-Stat told EE Times that according to his industry sources in Taiwan, Intel's Ivy Bridge server parts were only delayed from April 8 until April 29, though the dual core i5 and i7 parts for notebooks had been pushed out from a planned May 13th launch to June 3.
Core i3 parts would launch as planned on June 24, said McGregor.
That's three weeks - I am not sure a manufacturing glitch would fixable in 3 weeks considering cycletime is probably on the order of 10 to 12 weeks.
Nobody knows - someone makes an assumption - this will be repeated and than it becomes "news"
Why does not Sylvie digg up the interview or is there no written copy?
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.