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ricardonest
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re: iPad teardown reveals IC design winners
ricardonest   4/5/2012 5:45:14 PM
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I wonder if they discovered any possible solutions to keep the iPad temperature down, since that seemed to be the hot topic of the week when it was released. -Ricardo Nest Member of the semiconductor group at Patexia: http://www.patexia.com/pages/semiconductors/content

eewiz
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re: iPad teardown reveals IC design winners
eewiz   3/20/2012 3:03:37 PM
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which macbook are u using? I use a 2011 macbook pro 13" and the display ,1280x800, looks like its from the late 90s. Cant even remotely compare with the new iPad resolution.

the_floating_ gate
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re: iPad teardown reveals IC design winners
the_floating_ gate   3/19/2012 8:19:11 PM
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They must be really waiting for SoCs at 28 nm with HKMG. Monsieur Godot will come tomorrow - he promised for sure...now I am asking myself why and who does Apple's 45nm A5X ? - supposedly Samsung Austin. Obviously Apple was not willing to take risk stuck with a bloated chip fabbed with legacy technology. Unless Apple going to upgrade prior to introduction of A6 they are stuck for it for the next 12 months see quote: Another nugget from the day was the public announcement that Samsung is in full production with their 32-nm HKMG process, and it appears in Austin as well as Korea. I was hoping that we might see it in the new iPad, but we’ve now confirmed that the A5x chip is 45-nm. I guess we’ll have to wait for one of the new phones or tablets that will be out soon. ttp://www.electroiq.com/blogs/chipworks_real_chips_blog/2012/03/glofo-s-finfets-are-better-than-intel-s-musings-from-cptf.html

chipmonk0
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re: iPad teardown reveals IC design winners
chipmonk0   3/19/2012 5:21:23 PM
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answering my own question ! It can now be confirmed that the A5X is built by Samsung at 45 nm NOT 28 nm and it costs 50+ % more than the A5 ( perhaps becuase of the larger die size and the heat sink - something new for iPads ). The heat sink would be needed to spread the heat away from the hot spots generated on the chip when driving a higher - res screen. Memory can no longer be stacked over the Processor, thus increasing real estate and delays. Looks like SoCs are finally having to deal with CPU type problems. They must be really waiting for SoCs at 28 nm with HKMG.

chipmonk0
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re: iPad teardown reveals IC design winners
chipmonk0   3/19/2012 4:43:19 PM
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Looked up the teardown photos at iFixit. the A5x chip looks huge, nearly 15 mm sq., larger than the A5, just the 2 additional GPUs in the A5x seems to have blown up die size by 30 %. Is it already at 28 nm or is that on hold till the A6 ? TSMC has finally fessed up to yield problems at 28 nm but Samsung ( A5,..A6 ) is still persisting on " no problemo at 28 nm ". Any comments ?

JPBO
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re: iPad teardown reveals IC design winners
JPBO   3/19/2012 12:03:02 AM
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Nobody needs an iPad. Just many wants to have it, including me.

Daniel Payne
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re: iPad teardown reveals IC design winners
Daniel Payne   3/18/2012 12:03:21 AM
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I just bought the new iPad yesterday and can tell you two things: The 600dpi resolution does NOT make photos look better, in fact my 2009 MacBook Pro displays better resolution for both portrait and landscape images. Secondly, the Apple claim of 4X faster performance than a Tegra 3 is false, the tech folks at Gizmodo proved that yesterday in their benchmarks. Buyer beware, you have been warned.

_hm
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re: iPad teardown reveals IC design winners
_hm   3/17/2012 2:29:25 AM
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What software does Apple employs to design schematic, PCB for this product? It is also nice to know what kind of simulation tools do they use for for this.

t.alex
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re: iPad teardown reveals IC design winners
t.alex   3/17/2012 12:07:44 AM
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Broadcom chipset support FM transceiver? Is this linked to any feature of iPad?

Patk0317
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re: iPad teardown reveals IC design winners
Patk0317   3/16/2012 8:55:04 PM
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That's dedication. I will wait awhile before I decide if I need to get the latest iPad. How about you?

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