Hi Dylan, this appears to be a process improvement of the more general die-to-wafer bonding which is being used by many in 3D IC stacking. Seems like some details are missing here... how does TSMC handle the assembled and subsequently thinned to minimize manufacturing-induced warping?
NASA's Orion Flight Software Production Systems Manager Darrel G. Raines joins Planet Analog Editor Steve Taranovich and Embedded.com Editor Max Maxfield to talk about embedded flight software used on the Mars on EE Times Radio. Live radio show and live chat. Get your questions ready.