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docdivakar
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re: TSMC, Altera team on 3-D IC test vehicle
docdivakar   3/22/2012 7:42:18 PM
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Hi Dylan, this appears to be a process improvement of the more general die-to-wafer bonding which is being used by many in 3D IC stacking. Seems like some details are missing here... how does TSMC handle the assembled and subsequently thinned to minimize manufacturing-induced warping? MP Divakar



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