Hi Dylan, this appears to be a process improvement of the more general die-to-wafer bonding which is being used by many in 3D IC stacking. Seems like some details are missing here... how does TSMC handle the assembled and subsequently thinned to minimize manufacturing-induced warping?
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.