Breaking News
Comments
docdivakar
User Rank
Manager
re: TSMC, Altera team on 3-D IC test vehicle
docdivakar   3/22/2012 7:42:18 PM
NO RATINGS
Hi Dylan, this appears to be a process improvement of the more general die-to-wafer bonding which is being used by many in 3D IC stacking. Seems like some details are missing here... how does TSMC handle the assembled and subsequently thinned to minimize manufacturing-induced warping? MP Divakar



Most Recent Comments
seaEE
 
sweet janny
 
GSMD
 
patrick.mannion
 
resistion
 
Etmax
 
zeeglen
 
David Ashton
 
_hm
Flash Poll
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Want Your Own Desktop PCB Printer?
Max Maxfield
1 Comment
I just received a rather cheery email from Joshua R. Perk starting, "Hey Max, I love the work you do, so I thought I might write."

Karen Field

June 2014 Cartoon Caption Winner
Karen Field
7 comments
Congratulations to "Wnderer" for submitting the winning caption for our June cartoon, after much heated conversation by our judges, given the plethora of great entries.

Jeremy Cook

Inspection Rejection: Why More Is Less in a Vision System
Jeremy Cook
3 comments
Albert Einstein has been quoted as saying, "Everything should be as simple as possible, but not simpler." I would never claim to have his level of insight -- or such an awesome head of ...

Jeremy Cook

Machine Fixes That Made Me Go 'DUH!'
Jeremy Cook
21 comments
As you can see in my bio at the end of this article, I work as a manufacturing engineer. One of my favorite things that happens on a Friday late in the afternoon is to hear my phone ring ...

Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)