There is no doubt quite a bit of engineering has gone into Xi3's boxes. I did press for more detailed specs but was told it would be available in the coming weeks. On its website, Xi3 provides the specs for the modular computer but not the microserver:
Xi3's demo was in AMD's booth... I do know the Xi3 Microserver uses a dual-core 64-bit AMD CPU
Incidentally, the "3" in Xi3 stands for the three-part motherboard!
This does not seem very innovative except in style and marketing material. Launching a new design without the highest-speed next-generation interfaces makes it look like packaging exercise, as does the lack of tech specs in this press release.
This type of solution is very cool and a lot of engineering obviously went into it. Prospects should be concerned about lock in and system reuse however. I recently created a more COTS version that sits on a desk and sips 100 Watts per compute node http://www.crikit.info . We will be showing a 40Gbe version at CloudFair in Seattle in April. These types of compact, energy-efficient devices that run cloud software for on-premise and hybrid cloud configurations are the future of SMB and departmental computing. Very interesting times in computing. Moore's Law in action.
A good compact form but I see som potential issues of heat disspation when scaled. The either have to resort to chilled air circulation or alter the air movement across the chasis.
It would be interesting to know how much compute capacity in flops/sqmt this measures vs other offerings.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.