Yes, fabs are getting larger! This depends what you mean with "Fab". One cleanroom at 100k/m to 200k/m or 3 to 4 separate buildings adjacent at about 50k/m. Peter got it pretty much right, though $10B is on the high side! Don't forget Flash Alliance Fab 4 at 200k/m+, Fab 5 phase 1 and phase 2.
Clearly the US is not the only one moving manufacturing to China. This shows how being the country that manufactures the final product draws the manufacturing of the component parts over time. It's like a chain reaction.
thank you Peter, I remember saying to my students that a modern silicon fab can cost as much as 1Billion, and it wasn't that long time ago...looks that today's number is more like 10Billion...I wonder how long before it will reach 100Billion, probably at that point there will be 2-3 companies left standing...Kris
Well in the same story I referenced "Line 16" in Korea where Samsung is spending $10 billion.
The record will probably go to TSMC which has said it will spend about $10 billion on four phases of its "gigafab" Fab 15 with a total capacity of more than 100,000 12-inch wafers per month.
TSMC is also reported to have reserved the land for a 450-mm wafer fab development with a projected investment exceeding NT$800 billion (about $26 billion). But that is in the future and may include equipment development and process development costs.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.