Embedded Systems Conference
Breaking News
Comments
Newest First | Oldest First | Threaded View
<<   <   Page 3 / 3
Iacapital
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Iacapital   4/10/2012 5:58:29 PM
NO RATINGS
How could I make you another Sunday to keep writing good stuff like this? Coffee, Tea , or Me? Sorry, the humor should stop by coffee, tea, or money, definitely Not Me! Jimmy

Max The Magnificent
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Max The Magnificent   4/10/2012 12:50:19 PM
NO RATINGS
I must admit that I forgot to mention the whole concept of monolithic 3D ICs. I understand the concept, but I'm not well aware as to the nitty-gritty details, including how usable it is.

Max The Magnificent
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Max The Magnificent   4/10/2012 12:42:36 PM
NO RATINGS
Thanks David

Or_Bach
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Or_Bach   4/10/2012 7:29:18 AM
NO RATINGS
Lets continue and detail that the 3D-IC space has two main type. The TSV base and the monolithic 3D. The TSV is in most cases stacking of wafer process independently, than one wafer is thin to about 50 micron and stack as a die or a wafer on top of another wafer, and than connected using TSV that are about 5 micron. While monolithic 3D will be about a fabricating additional layer of semiconductor of 100nm on top of previous processed wafer and continue the processing of transistors and interconnects. The monolithic 3D would provide 10,000x higher vertical connections than TSV. We can find more information on some monolithic 3D flow in http://www.monolithic3d.com

David Ashton
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
David Ashton   4/10/2012 5:35:53 AM
NO RATINGS
Fascinating stuff and very good explanations - thanks Max.

Max The Magnificent
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Max The Magnificent   4/9/2012 9:02:15 PM
NO RATINGS
Arrggghhh -- now I'm kicking myself that I didn't mention this ... there's always something more, isn't there?

MikeSantarini
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
MikeSantarini   4/9/2012 8:41:53 PM
NO RATINGS
Great piece, Max. I think this is truly a fascinating technology that can certainly benefit by more tutorial information like you have provided. In fact, it seems that above and beyond how it differs from SiP and MCMs, a lot of folks seem to get 2.5D and 3D IC stacking confused with what was traditionally called finfet technology but has been recently rebranded seemingly be Intel as "tri-gate" or "multigate" transistor technology. This of course could get even more confusing if and when folks actually start doing 3D stacking with finfet based devices. Cheers, Mike

Max The Magnificent
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Max The Magnificent   4/9/2012 7:40:20 PM
NO RATINGS
Actually, thanks to you for taking the time to comment -- I spent a lot of my Sunday writing this, so it's really nice to know that someone took the time to read it (grin)

nicu_p
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
nicu_p   4/9/2012 6:31:54 PM
NO RATINGS
Very good 101 on the subject, thanks!

<<   <   Page 3 / 3


Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

March 28 is Arduino Day -- Break Out the Party Hats!
Max Maxfield
7 comments
Well, here's a bit of a conundrum. I just received an email from my chum David Ashton who hails from the "Unfinished Continent" Down Under. David's message was short and sweet; all he said ...

Bernard Cole

A Book For All Reasons
Bernard Cole
1 Comment
Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
5 comments
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
Radio
LATEST ARCHIVED BROADCAST
EE Times Senior Technical Editor Martin Rowe will interview EMC engineer Kenneth Wyatt.
Flash Poll