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Ganeh_K
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re: 2D vs. 2.5D vs. 3D ICs 101
Ganeh_K   4/12/2012 11:56:37 AM
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Really good material for starters. Thanks!

David Ashton
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re: 2D vs. 2.5D vs. 3D ICs 101
David Ashton   4/11/2012 10:52:36 AM
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PPS. Must have mis-spelt something, your Fundamentals of FPGAs is here http://www.eetimes.com/electrical-engineers/education-training/courses/4000134/Fundamentals-of-FPGAs And very good it is too, almost exactly what I asked for. So you can have the next 3 sundays off....

David Ashton
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re: 2D vs. 2.5D vs. 3D ICs 101
David Ashton   4/11/2012 9:26:54 AM
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PS Max I put FPGA fundamentals into the search box of the EETimes home page and I see you did something on this in 2008...however I get 404 errors on all of the links. Maybe you could resurrect that as a starting point? Not sure if I have seen it before...

David Ashton
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re: 2D vs. 2.5D vs. 3D ICs 101
David Ashton   4/10/2012 8:52:27 PM
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One thing I would like, that you would probably do very well Max, is something on how FPGAs are programmed, say from a specific application idea through the verilog/VHDL (not sure if that's right) to the actual programming. Next time you have a spare sunday (or three...)???

Iacapital
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re: 2D vs. 2.5D vs. 3D ICs 101
Iacapital   4/10/2012 5:58:29 PM
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How could I make you another Sunday to keep writing good stuff like this? Coffee, Tea , or Me? Sorry, the humor should stop by coffee, tea, or money, definitely Not Me! Jimmy

Max The Magnificent
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re: 2D vs. 2.5D vs. 3D ICs 101
Max The Magnificent   4/10/2012 12:50:19 PM
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I must admit that I forgot to mention the whole concept of monolithic 3D ICs. I understand the concept, but I'm not well aware as to the nitty-gritty details, including how usable it is.

Max The Magnificent
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re: 2D vs. 2.5D vs. 3D ICs 101
Max The Magnificent   4/10/2012 12:42:36 PM
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Thanks David

Or_Bach
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re: 2D vs. 2.5D vs. 3D ICs 101
Or_Bach   4/10/2012 7:29:18 AM
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Lets continue and detail that the 3D-IC space has two main type. The TSV base and the monolithic 3D. The TSV is in most cases stacking of wafer process independently, than one wafer is thin to about 50 micron and stack as a die or a wafer on top of another wafer, and than connected using TSV that are about 5 micron. While monolithic 3D will be about a fabricating additional layer of semiconductor of 100nm on top of previous processed wafer and continue the processing of transistors and interconnects. The monolithic 3D would provide 10,000x higher vertical connections than TSV. We can find more information on some monolithic 3D flow in http://www.monolithic3d.com

David Ashton
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re: 2D vs. 2.5D vs. 3D ICs 101
David Ashton   4/10/2012 5:35:53 AM
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Fascinating stuff and very good explanations - thanks Max.

Max The Magnificent
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re: 2D vs. 2.5D vs. 3D ICs 101
Max The Magnificent   4/9/2012 9:02:15 PM
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Arrggghhh -- now I'm kicking myself that I didn't mention this ... there's always something more, isn't there?

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