Embedded Systems Conference
Breaking News
Comments
Newest First | Oldest First | Threaded View
<<   <   Page 2 / 3   >   >>
KB3001
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
KB3001   7/22/2012 10:11:13 PM
NO RATINGS
Hi Max, Great job! As mentioned above, monolithic 3D deserves to be added. A similar job on various memory technologies: volatile (SRAM, S/DRAM etc.), non-volatile (E/E/PROM, NAND/NOR Flash etc.) would be very nice.... when you have time, no pressure (grin)

anilsinghal
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
anilsinghal   7/22/2012 6:59:43 AM
NO RATINGS
Thank you so much. This was perfect. A true 101 :)

Max The Magnificent
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Max The Magnificent   4/12/2012 7:15:36 PM
NO RATINGS
Thank you so much for your kind words -- I was worried about putting some of the simple stuff in, but for myself when I'm reading something by someone else, I always like to get the history and suchlike...

MindTech
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
MindTech   4/12/2012 4:53:05 PM
NO RATINGS
That was a fantastic summary. Thanks for spending the time to educate us that little bit more.

jonnydoin
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
jonnydoin   4/12/2012 2:55:33 PM
NO RATINGS
Max, very good mythbusting material. I recall that National Semi had stacked ICs for the NSC800, a Z-80 clone. You could simply plug RAM chips, eeprom, and a peripherals chip on top of the processor, to have a full computer on the DIP-40-pin socket of the processor. It could be called a "paleo-3D" technology [grin]. - Jonny

Max The Magnificent
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Max The Magnificent   4/12/2012 1:04:30 PM
NO RATINGS
Phew -- that's a relief :-)

Ganeh_K
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Ganeh_K   4/12/2012 11:56:37 AM
NO RATINGS
Really good material for starters. Thanks!

David Ashton
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
David Ashton   4/11/2012 10:52:36 AM
NO RATINGS
PPS. Must have mis-spelt something, your Fundamentals of FPGAs is here http://www.eetimes.com/electrical-engineers/education-training/courses/4000134/Fundamentals-of-FPGAs And very good it is too, almost exactly what I asked for. So you can have the next 3 sundays off....

David Ashton
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
David Ashton   4/11/2012 9:26:54 AM
NO RATINGS
PS Max I put FPGA fundamentals into the search box of the EETimes home page and I see you did something on this in 2008...however I get 404 errors on all of the links. Maybe you could resurrect that as a starting point? Not sure if I have seen it before...

David Ashton
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
David Ashton   4/10/2012 8:52:27 PM
NO RATINGS
One thing I would like, that you would probably do very well Max, is something on how FPGAs are programmed, say from a specific application idea through the verilog/VHDL (not sure if that's right) to the actual programming. Next time you have a spare sunday (or three...)???

<<   <   Page 2 / 3   >   >>


Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Teensy-Weensy GPAK4 Mixed Signal FPGAs
Max Maxfield
Post a comment
The vast majority of the embedded designers I know typically create MCU-based systems -- they rarely even consider using a Field-Programmable Gate Array (FPGA).

Bernard Cole

A Book For All Reasons
Bernard Cole
1 Comment
Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
5 comments
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
Radio
LATEST ARCHIVED BROADCAST
EE Times Senior Technical Editor Martin Rowe will interview EMC engineer Kenneth Wyatt.
Flash Poll