Embedded Systems Conference
Breaking News
Comments
Oldest First | Newest First | Threaded View
Page 1 / 3   >   >>
nicu_p
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
nicu_p   4/9/2012 6:31:54 PM
NO RATINGS
Very good 101 on the subject, thanks!

Max The Magnificent
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Max The Magnificent   4/9/2012 7:40:20 PM
NO RATINGS
Actually, thanks to you for taking the time to comment -- I spent a lot of my Sunday writing this, so it's really nice to know that someone took the time to read it (grin)

MikeSantarini
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
MikeSantarini   4/9/2012 8:41:53 PM
NO RATINGS
Great piece, Max. I think this is truly a fascinating technology that can certainly benefit by more tutorial information like you have provided. In fact, it seems that above and beyond how it differs from SiP and MCMs, a lot of folks seem to get 2.5D and 3D IC stacking confused with what was traditionally called finfet technology but has been recently rebranded seemingly be Intel as "tri-gate" or "multigate" transistor technology. This of course could get even more confusing if and when folks actually start doing 3D stacking with finfet based devices. Cheers, Mike

Max The Magnificent
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Max The Magnificent   4/9/2012 9:02:15 PM
NO RATINGS
Arrggghhh -- now I'm kicking myself that I didn't mention this ... there's always something more, isn't there?

David Ashton
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
David Ashton   4/10/2012 5:35:53 AM
NO RATINGS
Fascinating stuff and very good explanations - thanks Max.

Or_Bach
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Or_Bach   4/10/2012 7:29:18 AM
NO RATINGS
Lets continue and detail that the 3D-IC space has two main type. The TSV base and the monolithic 3D. The TSV is in most cases stacking of wafer process independently, than one wafer is thin to about 50 micron and stack as a die or a wafer on top of another wafer, and than connected using TSV that are about 5 micron. While monolithic 3D will be about a fabricating additional layer of semiconductor of 100nm on top of previous processed wafer and continue the processing of transistors and interconnects. The monolithic 3D would provide 10,000x higher vertical connections than TSV. We can find more information on some monolithic 3D flow in http://www.monolithic3d.com

Max The Magnificent
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Max The Magnificent   4/10/2012 12:42:36 PM
NO RATINGS
Thanks David

Max The Magnificent
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Max The Magnificent   4/10/2012 12:50:19 PM
NO RATINGS
I must admit that I forgot to mention the whole concept of monolithic 3D ICs. I understand the concept, but I'm not well aware as to the nitty-gritty details, including how usable it is.

Iacapital
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Iacapital   4/10/2012 5:58:29 PM
NO RATINGS
How could I make you another Sunday to keep writing good stuff like this? Coffee, Tea , or Me? Sorry, the humor should stop by coffee, tea, or money, definitely Not Me! Jimmy

David Ashton
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
David Ashton   4/10/2012 8:52:27 PM
NO RATINGS
One thing I would like, that you would probably do very well Max, is something on how FPGAs are programmed, say from a specific application idea through the verilog/VHDL (not sure if that's right) to the actual programming. Next time you have a spare sunday (or three...)???

Page 1 / 3   >   >>


Radio
NEXT UPCOMING BROADCAST
In conjunction with unveiling of EE Times’ Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. One of Silicon Valley's great contributions to the world has been the demonstration of how the application of entrepreneurship and venture capital to electronics and semiconductor hardware can create wealth with developments in semiconductors, displays, design automation, MEMS and across the breadth of hardware developments. But in recent years concerns have been raised that traditional venture capital has turned its back on hardware-related startups in favor of software and Internet applications and services. Panelists from incubators join Peter Clarke in debate.
Flash Poll
Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Special Video Section
The LTC®4015 is a complete synchronous buck controller/ ...
10:35
The LT®3042 is a high performance low dropout linear ...
Chwan-Jye Foo (C.J Foo), product marketing manager for ...
The LT®3752/LT3752-1 are current mode PWM controllers ...
LED lighting is an important feature in today’s and future ...
Active balancing of series connected battery stacks exists ...
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...