Breaking News
Comments
Oldest First | Newest First | Threaded View
Page 1 / 3   >   >>
nicu_p
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
nicu_p   4/9/2012 6:31:54 PM
NO RATINGS
Very good 101 on the subject, thanks!

Max The Magnificent
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Max The Magnificent   4/9/2012 7:40:20 PM
NO RATINGS
Actually, thanks to you for taking the time to comment -- I spent a lot of my Sunday writing this, so it's really nice to know that someone took the time to read it (grin)

MikeSantarini
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
MikeSantarini   4/9/2012 8:41:53 PM
NO RATINGS
Great piece, Max. I think this is truly a fascinating technology that can certainly benefit by more tutorial information like you have provided. In fact, it seems that above and beyond how it differs from SiP and MCMs, a lot of folks seem to get 2.5D and 3D IC stacking confused with what was traditionally called finfet technology but has been recently rebranded seemingly be Intel as "tri-gate" or "multigate" transistor technology. This of course could get even more confusing if and when folks actually start doing 3D stacking with finfet based devices. Cheers, Mike

Max The Magnificent
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Max The Magnificent   4/9/2012 9:02:15 PM
NO RATINGS
Arrggghhh -- now I'm kicking myself that I didn't mention this ... there's always something more, isn't there?

David Ashton
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
David Ashton   4/10/2012 5:35:53 AM
NO RATINGS
Fascinating stuff and very good explanations - thanks Max.

Or_Bach
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Or_Bach   4/10/2012 7:29:18 AM
NO RATINGS
Lets continue and detail that the 3D-IC space has two main type. The TSV base and the monolithic 3D. The TSV is in most cases stacking of wafer process independently, than one wafer is thin to about 50 micron and stack as a die or a wafer on top of another wafer, and than connected using TSV that are about 5 micron. While monolithic 3D will be about a fabricating additional layer of semiconductor of 100nm on top of previous processed wafer and continue the processing of transistors and interconnects. The monolithic 3D would provide 10,000x higher vertical connections than TSV. We can find more information on some monolithic 3D flow in http://www.monolithic3d.com

Max The Magnificent
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Max The Magnificent   4/10/2012 12:42:36 PM
NO RATINGS
Thanks David

Max The Magnificent
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Max The Magnificent   4/10/2012 12:50:19 PM
NO RATINGS
I must admit that I forgot to mention the whole concept of monolithic 3D ICs. I understand the concept, but I'm not well aware as to the nitty-gritty details, including how usable it is.

Iacapital
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
Iacapital   4/10/2012 5:58:29 PM
NO RATINGS
How could I make you another Sunday to keep writing good stuff like this? Coffee, Tea , or Me? Sorry, the humor should stop by coffee, tea, or money, definitely Not Me! Jimmy

David Ashton
User Rank
Author
re: 2D vs. 2.5D vs. 3D ICs 101
David Ashton   4/10/2012 8:52:27 PM
NO RATINGS
One thing I would like, that you would probably do very well Max, is something on how FPGAs are programmed, say from a specific application idea through the verilog/VHDL (not sure if that's right) to the actual programming. Next time you have a spare sunday (or three...)???

Page 1 / 3   >   >>


Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Like Us on Facebook
Special Video Section
Protecting sensitive electronic circuitry from voltage ...
09:45
Watch as a web server authenticates or rejects a water ...
Protecting sensitive electronic circuitry from voltage ...
Watch as a web server authenticates or rejects a water ...
Protecting sensitive electronic circuitry from voltage ...
Power can be a gating factor in success or failure of ...
Get to market faster and connect your next product to the ...
00:44
See how microQSFP is setting a new standard for tomorrow’s ...
The LTC3649 step-down regulator combines key features of a ...
Once the base layer of a design has been taped out, making ...
In this short video we show an LED light demo to ...
The LTC2380-24 is a versatile 24-bit SAR ADC that combines ...
In this short video we show an LED light demo to ...
02:46
Wireless Power enables applications where it is difficult ...
07:41
LEDs are being used in current luxury model automotive ...
With design sizes expected to increase by 5X through 2020, ...
01:48
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27